Booz Allen Hamilton
Microelectronics Lab Support Engineer
Booz Allen Hamilton, Wright-Patterson AFB, Ohio, United States
Booz Allen’s mission is to empower people to change the world. Join our team and support critical government research and development programs related to microelectronics design and verification.
You'll work with industry-leading engineers in world-class research facilities to impact national security investment through the new development of military applications for cutting-edge technologies. You'll maintain and leverage technical expertise and build lasting relationships in serving clients.
As a microelectronics lab support engineer, you will work with a team of engineers, scientists, and researchers to test, evaluate, and integrate the next generation of microelectronic designs critical to our national interests. You'll assist your colleagues and clients in developing testbenches to evaluate performance of in-house and commercial test articles and building test setups independently using functional and parametric testing techniques.
You'll work hands-on with DC, RF, and optical test systems, manage reliability test setups, and develop innovative testing strategies. You'll conduct reliability assessments, degradation analysis, and lifetime modeling for a wide range of semiconductor devices, including digital, analog, and RF components to evaluate reliability, trust, and assurance.
You’ll research and implement packaging and integration solutions by designing microelectronic components, packages, and boards for RF and reliability systems.
In this role, you'll provide technical management support and strategic assessments of new technologies to support senior DoD decision-makers, including conducting background research in evaluating the feasibility of and potential applications for new technological concepts.
Responsibilities and Qualifications
Experience with developing and executing test plans and reports to document progress and results of lab bench testing Experience with semiconductor electronics testing in a lab setting Experience with benchtop equipment, such as DMMs, oscilloscopes, and microscopes Experience with 2D and 3D CAD, or 3D printing Experience with leading independent or small technical groups in planning, executing, and delivering complete projects Knowledge of data analysis and statistical classification methods Knowledge of semiconductor packaging technologies and integrated circuit (IC) design, including wafer-level packaging and wire bonding techniques Ability to obtain a Secret clearance Bachelor’s degree Nice to Have
Experience as a task or project lead for technical lab activities Experience with performing functional and parametric custom IC test article evaluation using automated testbench development in LabVIEW, TestStand, Python, or similar environments Experience with Labview, TestStand, MATLAB, C, C++, Python, TCL, or other scripting language Experience with industry standards, such as JEDEC, MIL-STD, or AEC reliability practices and RF and high-temperature electronics reliability testing Knowledge of AFRL lab equipment, such as National Instruments, Keysight, PXie modular test equipment, and automatic test equipment (ATE), such as the NI STS Knowledge of advanced reliability analyses, including Failure Modes and Effects Analysis (FMEA), step-stress, high-temperature accelerated life, and operational life testing, wafer testing with DC and RF supply, physical and electrical failure analysis, including thermal CW and transient imaging, X-ray, electroluminescence, and Scanning Electron Microscope (SEM) Knowledge of semiconductor physics and degradation mechanisms in GaN, SiC, and CMOS devices Ability to identify and analyze gaps in test methodologies Possession of excellent verbal and written communication skills, including preparing and delivering technical briefings and reports, conference publications, and regular status updates to government program managers Master's degree in Electrical Engineering or Computer Engineering preferred; Doctorate degree in Electrical Engineering or Computer Engineering a plus Clearance: Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information. Booz Allen is an equal opportunities employer and welcomes applications from all qualified candidates. We are committed to non-discrimination and equal employment opportunities for all employees and applicants.
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Experience with developing and executing test plans and reports to document progress and results of lab bench testing Experience with semiconductor electronics testing in a lab setting Experience with benchtop equipment, such as DMMs, oscilloscopes, and microscopes Experience with 2D and 3D CAD, or 3D printing Experience with leading independent or small technical groups in planning, executing, and delivering complete projects Knowledge of data analysis and statistical classification methods Knowledge of semiconductor packaging technologies and integrated circuit (IC) design, including wafer-level packaging and wire bonding techniques Ability to obtain a Secret clearance Bachelor’s degree Nice to Have
Experience as a task or project lead for technical lab activities Experience with performing functional and parametric custom IC test article evaluation using automated testbench development in LabVIEW, TestStand, Python, or similar environments Experience with Labview, TestStand, MATLAB, C, C++, Python, TCL, or other scripting language Experience with industry standards, such as JEDEC, MIL-STD, or AEC reliability practices and RF and high-temperature electronics reliability testing Knowledge of AFRL lab equipment, such as National Instruments, Keysight, PXie modular test equipment, and automatic test equipment (ATE), such as the NI STS Knowledge of advanced reliability analyses, including Failure Modes and Effects Analysis (FMEA), step-stress, high-temperature accelerated life, and operational life testing, wafer testing with DC and RF supply, physical and electrical failure analysis, including thermal CW and transient imaging, X-ray, electroluminescence, and Scanning Electron Microscope (SEM) Knowledge of semiconductor physics and degradation mechanisms in GaN, SiC, and CMOS devices Ability to identify and analyze gaps in test methodologies Possession of excellent verbal and written communication skills, including preparing and delivering technical briefings and reports, conference publications, and regular status updates to government program managers Master's degree in Electrical Engineering or Computer Engineering preferred; Doctorate degree in Electrical Engineering or Computer Engineering a plus Clearance: Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information. Booz Allen is an equal opportunities employer and welcomes applications from all qualified candidates. We are committed to non-discrimination and equal employment opportunities for all employees and applicants.
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