Samsung Semiconductor
Overview
Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and debonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintain detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility to ensure smooth 24/7 wafer bonding operation.
Role And Responsibilities
Equipment Setup and Operation
Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements
Ensure tool-to-tool matching across fabs and between tools
Develop and maintain Preventative Maintenance schedules and procedures
Ensure bonding meets device and process output specifications
Successfully transfer and qualify process from development fab to high-volume manufacturing facility
Technical Troubleshooting
Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans
Provide clear updates and instructions to users and management regarding ongoing issues and resolutions
Maintain FMEA and manage RPN reduction activity
Equipment and Process Continuous Improvement
Lead development and design experiments to improve bonding yield, reliability, cost, and throughput
Collaborate with vendors in evaluation and qualification of new bonding and de-bonding techniques
Talent Development
Provide technical support and training to operators and technicians on equipment operation and procedures
Present key technical developments to SAS technical staff and management
Skills And Qualifications
Required / Strongly Desired Knowledge/Skills: Knowledge and familiarity with hybrid bonding techniques and equipment
Bachelor’s degree in Engineering or a related technical discipline
Minimum of 5 years of engineering experience in Fab Equipment management
Minimum of 3 years in wafer bonding and de-bonding equipment
Experience in the semiconductor environment or in high-volume advanced manufacturing
Desire to take on technical challenges and shifting priorities in a fast-paced cutting-edge environment
Able to work with others in a team-oriented culture
Experience with data analysis: ability to quickly analyze, summarize, and present data in an easy-to-understand format
Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long-term projects with daily sustaining
Ability to rapidly come up to speed with new computer applications and systems
Able to work for several hours per day in a clean room environment
Desired Knowledge/Skills but not required: Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.
Ability to manipulate and interpret equipment sensor data for advanced equipment troubleshooting and setting up controls for equipment sensors
VBA, Python, R, SQL, or other basic programming
The current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors including organizational and individual performance.
Total Rewards At Samsung SAS, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location. We offer a comprehensive benefits package, including:
Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE
Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance. All positions at SAS are full-time on-site.
U.S. Export Control Compliance This role requires access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.
Trade Secrets Notice By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.
All positions at SAS are on-site and full-time.
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Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and debonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintain detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility to ensure smooth 24/7 wafer bonding operation.
Role And Responsibilities
Equipment Setup and Operation
Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements
Ensure tool-to-tool matching across fabs and between tools
Develop and maintain Preventative Maintenance schedules and procedures
Ensure bonding meets device and process output specifications
Successfully transfer and qualify process from development fab to high-volume manufacturing facility
Technical Troubleshooting
Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans
Provide clear updates and instructions to users and management regarding ongoing issues and resolutions
Maintain FMEA and manage RPN reduction activity
Equipment and Process Continuous Improvement
Lead development and design experiments to improve bonding yield, reliability, cost, and throughput
Collaborate with vendors in evaluation and qualification of new bonding and de-bonding techniques
Talent Development
Provide technical support and training to operators and technicians on equipment operation and procedures
Present key technical developments to SAS technical staff and management
Skills And Qualifications
Required / Strongly Desired Knowledge/Skills: Knowledge and familiarity with hybrid bonding techniques and equipment
Bachelor’s degree in Engineering or a related technical discipline
Minimum of 5 years of engineering experience in Fab Equipment management
Minimum of 3 years in wafer bonding and de-bonding equipment
Experience in the semiconductor environment or in high-volume advanced manufacturing
Desire to take on technical challenges and shifting priorities in a fast-paced cutting-edge environment
Able to work with others in a team-oriented culture
Experience with data analysis: ability to quickly analyze, summarize, and present data in an easy-to-understand format
Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long-term projects with daily sustaining
Ability to rapidly come up to speed with new computer applications and systems
Able to work for several hours per day in a clean room environment
Desired Knowledge/Skills but not required: Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.
Ability to manipulate and interpret equipment sensor data for advanced equipment troubleshooting and setting up controls for equipment sensors
VBA, Python, R, SQL, or other basic programming
The current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors including organizational and individual performance.
Total Rewards At Samsung SAS, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location. We offer a comprehensive benefits package, including:
Medical, dental, and vision insurance
Life insurance and 401(k) matching with immediate vesting
Onsite café(s) and workout facilities
Paid maternity and paternity leave
Paid time off (PTO) + 2 personal holidays and 10 regular holidays
Wellness incentives and MORE
Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance. All positions at SAS are full-time on-site.
U.S. Export Control Compliance This role requires access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.
Trade Secrets Notice By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.
All positions at SAS are on-site and full-time.
#J-18808-Ljbffr