Northrop Grumman
Sr Principal Process Engineer Microelectronics - R10208202
Northrop Grumman, Linthicum, Maryland, United States
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Sr Principal Process Engineer Microelectronics - R10208202
role at
Northrop Grumman . We are looking for a highly motivated and experienced professional to join our team in a production and manufacturing role focused on mechanical manufacturing processes, process improvement, and technical leadership in semiconductor manufacturing. The position is based in
Linthicum, MD , with travel required and Secret clearance eligibility. Overview
As a Senior Principal Microelectronics Process Engineer, you will develop and refine manufacturing processes, work instructions, and production layouts to fabricate products at wafer and die levels. You will support process flow from wafer AOI through die-level inspection, pick-and-place assembly, tape-and-reel packaging, and final product packaging, while collaborating with internal teams and external vendors to troubleshoot and implement improvements. Responsibilities
Process Development & Control: Develop and optimize manufacturing processes for wafer- and die-level AOI, pick-and-place assembly, tape-and-reel packaging, and final product handling. Write detailed work instructions and ensure alignment with quality standards. Inspection & Quality: Use AOI equipment for wafer and die inspection, analyze data to identify defects, and support yield improvement initiatives. Assembly Operations: Oversee die placement, bonding, and alignment; integrate automated equipment and work with vendors on troubleshooting and upgrades. Packaging Operations: Support tape-and-reel activities to meet customer delivery requirements with consistent packaging quality and traceability. Continuous Improvement: Identify process improvements, capture operations feedback, implement changes, and lead root cause analyses for yield and scrap issues. Cross-Functional Collaboration: Support an Integrated Product Team with internal engineering and external customers; partner with maintenance, safety, and operations staff to troubleshoot and upgrade equipment. Data Analysis & Reporting: Analyze yield, scrap rate, and downtime data to drive process optimization; monitor process capability and equipment performance. Leadership & Safety: Provide technical leadership, generate specifications for new equipment, and establish facility safety requirements according to industry standards. Basic Qualifications
Bachelor’s Degree in Mechanical Engineering, Electrical Engineering, or Software Engineering with 8+ years of relevant experience; Master’s Degree with 6+ years; or PhD with 4+ years. Hands-on experience with wafer-level and die-level Automated Optical Inspection (AOI) systems. Familiarity with tape-and-reel packaging processes and JEDEC packaging standards. Ability to read and interpret 2D drawings and technical specifications. Knowledge of ESD, MSL, and cleanroom handling practices. Experience in a production/manufacturing environment. Ability to develop manufacturing processes, work instructions, and production layouts required to fabricate the product; capture design/ specification changes into manufacturing processes. Experience generating equipment procurement specifications and analyzing yield/scrap data to drive improvements. Experience with automation equipment and/or machinery. U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required. Preferred Qualifications
Master’s degree in Mechanical, Manufacturing, or Electrical Engineering. 5+ years in semiconductor packaging, assembly, or microelectronics manufacturing. Experience developing manufacturing work instructions and process documentation; familiarity with SPC, FMEA, and Lean Six Sigma. Ability to mentor junior engineers or technicians; strong technical leadership. Experience in lean manufacturing practices and structured problem-solving; semiconductor/microelectronics fab experience. Active Secret clearance. The above salary range and benefits reflect general guidelines; actual offers consider scope, responsibilities, experience, education, skills, and market conditions. Northrop Grumman offers benefits including health insurance, life and disability insurance, a savings plan, holidays, and PTO. Some positions may include overtime, shift differential, bonuses, and long-term incentives. Northrop Grumman is an Equal Opportunity Employer. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for positions with government clearance.
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Sr Principal Process Engineer Microelectronics - R10208202
role at
Northrop Grumman . We are looking for a highly motivated and experienced professional to join our team in a production and manufacturing role focused on mechanical manufacturing processes, process improvement, and technical leadership in semiconductor manufacturing. The position is based in
Linthicum, MD , with travel required and Secret clearance eligibility. Overview
As a Senior Principal Microelectronics Process Engineer, you will develop and refine manufacturing processes, work instructions, and production layouts to fabricate products at wafer and die levels. You will support process flow from wafer AOI through die-level inspection, pick-and-place assembly, tape-and-reel packaging, and final product packaging, while collaborating with internal teams and external vendors to troubleshoot and implement improvements. Responsibilities
Process Development & Control: Develop and optimize manufacturing processes for wafer- and die-level AOI, pick-and-place assembly, tape-and-reel packaging, and final product handling. Write detailed work instructions and ensure alignment with quality standards. Inspection & Quality: Use AOI equipment for wafer and die inspection, analyze data to identify defects, and support yield improvement initiatives. Assembly Operations: Oversee die placement, bonding, and alignment; integrate automated equipment and work with vendors on troubleshooting and upgrades. Packaging Operations: Support tape-and-reel activities to meet customer delivery requirements with consistent packaging quality and traceability. Continuous Improvement: Identify process improvements, capture operations feedback, implement changes, and lead root cause analyses for yield and scrap issues. Cross-Functional Collaboration: Support an Integrated Product Team with internal engineering and external customers; partner with maintenance, safety, and operations staff to troubleshoot and upgrade equipment. Data Analysis & Reporting: Analyze yield, scrap rate, and downtime data to drive process optimization; monitor process capability and equipment performance. Leadership & Safety: Provide technical leadership, generate specifications for new equipment, and establish facility safety requirements according to industry standards. Basic Qualifications
Bachelor’s Degree in Mechanical Engineering, Electrical Engineering, or Software Engineering with 8+ years of relevant experience; Master’s Degree with 6+ years; or PhD with 4+ years. Hands-on experience with wafer-level and die-level Automated Optical Inspection (AOI) systems. Familiarity with tape-and-reel packaging processes and JEDEC packaging standards. Ability to read and interpret 2D drawings and technical specifications. Knowledge of ESD, MSL, and cleanroom handling practices. Experience in a production/manufacturing environment. Ability to develop manufacturing processes, work instructions, and production layouts required to fabricate the product; capture design/ specification changes into manufacturing processes. Experience generating equipment procurement specifications and analyzing yield/scrap data to drive improvements. Experience with automation equipment and/or machinery. U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required. Preferred Qualifications
Master’s degree in Mechanical, Manufacturing, or Electrical Engineering. 5+ years in semiconductor packaging, assembly, or microelectronics manufacturing. Experience developing manufacturing work instructions and process documentation; familiarity with SPC, FMEA, and Lean Six Sigma. Ability to mentor junior engineers or technicians; strong technical leadership. Experience in lean manufacturing practices and structured problem-solving; semiconductor/microelectronics fab experience. Active Secret clearance. The above salary range and benefits reflect general guidelines; actual offers consider scope, responsibilities, experience, education, skills, and market conditions. Northrop Grumman offers benefits including health insurance, life and disability insurance, a savings plan, holidays, and PTO. Some positions may include overtime, shift differential, bonuses, and long-term incentives. Northrop Grumman is an Equal Opportunity Employer. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for positions with government clearance.
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