FLIR
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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, environmental monitoring, electronics, oceanographic research, oil and gas exploration, medical imaging, and pharmaceuticals. We seek individuals who thrive on impact and enjoy being part of a winning team. Job Description
Teledyne Imaging Sensors pioneers infrared sensors used in space exploration, with clients like NASA, ESA, and the US Department of Defense. Our sensors are used in telescopes, satellites, space stations, climate study instruments, tactical systems, and microscopes. We value technical excellence, collaboration, and agility.
Launch your career with us ! We are hiring a
Wafer Dicing Technician
to support semiconductor wafer preparation and dicing operations. Essential Duties and Responsibilities
Support daily wafer dicing activities, including labeling, mounting, sawing, demounting, cleaning, measuring, and inspecting wafers. Follow process travelers, drawings, work instructions, and procedures. Coordinate with engineers for quality control and process improvements. Document nonconformities and assist in root cause analysis. Adhere to laboratory protocols and safety procedures. Utilize Manufacturing Execution System (MES) for process data recording and reporting. Maintain equipment in good condition and calibration. Work in an offset shift between first and second shifts. Qualifications & Competencies
Understanding of mechanical drawings, dimensions, and tolerances. Experience with digital microscopes and metrology tools. Proficiency in Microsoft Office Suite. Strong communication skills and basic arithmetic. Manual dexterity for handling small components. Teamwork and ethical conduct, with safety awareness. Education and Experience
High School diploma with at least three years of relevant experience or an associate degree with one year of experience. Citizenship Requirement
Applicants must be U.S. Citizens due to access restrictions. Join Our Team!
Apply today! What We Offer
Competitive salary and benefits. Health, dental, vision, and life insurance from day one. Paid vacation, sick leave, and holidays. 401(k) with company match. Stock purchase plan. Tuition reimbursement. Fun employee events. Salary Range
$50,500.00 - $67,300.00 Pay Transparency
The listed salary is an estimate; actual compensation depends on various factors including location, experience, and skills. Teledyne is committed to ethical business practices and equal opportunity employment.
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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, environmental monitoring, electronics, oceanographic research, oil and gas exploration, medical imaging, and pharmaceuticals. We seek individuals who thrive on impact and enjoy being part of a winning team. Job Description
Teledyne Imaging Sensors pioneers infrared sensors used in space exploration, with clients like NASA, ESA, and the US Department of Defense. Our sensors are used in telescopes, satellites, space stations, climate study instruments, tactical systems, and microscopes. We value technical excellence, collaboration, and agility.
Launch your career with us ! We are hiring a
Wafer Dicing Technician
to support semiconductor wafer preparation and dicing operations. Essential Duties and Responsibilities
Support daily wafer dicing activities, including labeling, mounting, sawing, demounting, cleaning, measuring, and inspecting wafers. Follow process travelers, drawings, work instructions, and procedures. Coordinate with engineers for quality control and process improvements. Document nonconformities and assist in root cause analysis. Adhere to laboratory protocols and safety procedures. Utilize Manufacturing Execution System (MES) for process data recording and reporting. Maintain equipment in good condition and calibration. Work in an offset shift between first and second shifts. Qualifications & Competencies
Understanding of mechanical drawings, dimensions, and tolerances. Experience with digital microscopes and metrology tools. Proficiency in Microsoft Office Suite. Strong communication skills and basic arithmetic. Manual dexterity for handling small components. Teamwork and ethical conduct, with safety awareness. Education and Experience
High School diploma with at least three years of relevant experience or an associate degree with one year of experience. Citizenship Requirement
Applicants must be U.S. Citizens due to access restrictions. Join Our Team!
Apply today! What We Offer
Competitive salary and benefits. Health, dental, vision, and life insurance from day one. Paid vacation, sick leave, and holidays. 401(k) with company match. Stock purchase plan. Tuition reimbursement. Fun employee events. Salary Range
$50,500.00 - $67,300.00 Pay Transparency
The listed salary is an estimate; actual compensation depends on various factors including location, experience, and skills. Teledyne is committed to ethical business practices and equal opportunity employment.
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