Amphenol ICC
Overview
Signal Integrity Engineer – IO board connector signal integrity design and development including different form factors OSFP, QSFP-DD, QSFP for 224G. Connector PCB board/test cards simulation and optimization for 112G and 224G datacenter applications. Customer technical support for 10 connectors including OSFP, QSFP-DD, QSFP form factors. Signal integrity testing and debug for connector test boards using Vector Network Analyzer (VNA) and Time Domain Reflectometer equipment. Responsibilities
Design and development of IO board connectors for signal integrity across form factors OSFP, QSFP-DD, QSFP (224G). Simulation and optimization of connectors on PCB/test cards for 112G and 224G data-center applications. Provide customer technical support for 10 connectors including OSFP, QSFP-DD, QSFP. Perform signal integrity testing and debugging for connector test boards using VNA and TDR equipment. Requirements
Bachelor’s degree or equivalent in electrical engineering or closely related field, and three years of experience in electrical engineering or related field; or Master’s degree and one year of experience. If qualifying by bachelor’s degree: at least 3 years’ experience with S-parameters and Ansys HFSS, and 3 years’ experience with RF, Electromagnetics or Signal Integrity. If qualifying by master’s degree: at least 1 year experience with S-parameters and Ansys HFSS, and 1 year experience with RF, Electromagnetics or Signal Integrity. Multiple Positions Open Position located in Nashua, NH. If qualified, apply below.
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Signal Integrity Engineer – IO board connector signal integrity design and development including different form factors OSFP, QSFP-DD, QSFP for 224G. Connector PCB board/test cards simulation and optimization for 112G and 224G datacenter applications. Customer technical support for 10 connectors including OSFP, QSFP-DD, QSFP form factors. Signal integrity testing and debug for connector test boards using Vector Network Analyzer (VNA) and Time Domain Reflectometer equipment. Responsibilities
Design and development of IO board connectors for signal integrity across form factors OSFP, QSFP-DD, QSFP (224G). Simulation and optimization of connectors on PCB/test cards for 112G and 224G data-center applications. Provide customer technical support for 10 connectors including OSFP, QSFP-DD, QSFP. Perform signal integrity testing and debugging for connector test boards using VNA and TDR equipment. Requirements
Bachelor’s degree or equivalent in electrical engineering or closely related field, and three years of experience in electrical engineering or related field; or Master’s degree and one year of experience. If qualifying by bachelor’s degree: at least 3 years’ experience with S-parameters and Ansys HFSS, and 3 years’ experience with RF, Electromagnetics or Signal Integrity. If qualifying by master’s degree: at least 1 year experience with S-parameters and Ansys HFSS, and 1 year experience with RF, Electromagnetics or Signal Integrity. Multiple Positions Open Position located in Nashua, NH. If qualified, apply below.
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