PlanIT Group, LLC
Assembler - Microelectronics Wire Bonder
PlanIT Group, LLC, Chelmsford, Massachusetts, us, 01824
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Assembler - Microelectronics Wire Bonder
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PlanIT Group, LLC
Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
Job Details
Location: Chelmsford, MA
Shift: Day shift, Full-Time (M-TH) 4:00 PM - 2:30 AM
Starting Salary: $27.00 - $29.00 / hour
Hours: 4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
What You'll Do
Fabricate microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
Read and interpret assembly process/work instructions and work instruction processes.
Work with microscopic to large components that may require visual magnification for entire shift.
Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
Maintain accurate data entry related to production processes.
Collaborate with team members to improve throughput and continuous improvement.
What We're Looking For
Familiarity with bonding microelectronic components and manual gold ball and ribbon bonding.
Familiarity with manual bonding equipment and automatic bonding equipment.
Basic computer skills, including navigating digital systems for timekeeping, work instructions, and task confirmation.
Strong attention to detail and ability to work in a fast-paced environment.
Ability to follow written and verbal instructions.
Ability to learn J-STD-001 and/or IPC-A-610.
Knowledge of ESD procedures and test equipment.
Strong work ethic, punctuality, and reliability, with a desire to grow and learn.
High school diploma or GED required.
Seniority level Entry level
Employment type Contract
Job function Management and Manufacturing
This job is active and accepting applications.
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Assembler - Microelectronics Wire Bonder
role at
PlanIT Group, LLC
Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
Job Details
Location: Chelmsford, MA
Shift: Day shift, Full-Time (M-TH) 4:00 PM - 2:30 AM
Starting Salary: $27.00 - $29.00 / hour
Hours: 4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
What You'll Do
Fabricate microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
Read and interpret assembly process/work instructions and work instruction processes.
Work with microscopic to large components that may require visual magnification for entire shift.
Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
Maintain accurate data entry related to production processes.
Collaborate with team members to improve throughput and continuous improvement.
What We're Looking For
Familiarity with bonding microelectronic components and manual gold ball and ribbon bonding.
Familiarity with manual bonding equipment and automatic bonding equipment.
Basic computer skills, including navigating digital systems for timekeeping, work instructions, and task confirmation.
Strong attention to detail and ability to work in a fast-paced environment.
Ability to follow written and verbal instructions.
Ability to learn J-STD-001 and/or IPC-A-610.
Knowledge of ESD procedures and test equipment.
Strong work ethic, punctuality, and reliability, with a desire to grow and learn.
High school diploma or GED required.
Seniority level Entry level
Employment type Contract
Job function Management and Manufacturing
This job is active and accepting applications.
#J-18808-Ljbffr