Tom Trese
Principal Application Engineer, Advanced Packaging Materials
Tom Trese, Irvine, California, United States, 92713
Principal Application Engineer, Advanced Packaging Materials
Irvine, California, United States
$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation Overview
This role is for a
Principal Application Engineer
to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers. Key Responsibilities
Technical Leadership:
Serve as the technical lead on developmental and commercialized products by optimizing material application processes.
Customer Interaction:
Directly interact with customers to troubleshoot and solve product and process-related problems.
Value Creation:
Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.
Problem Solving:
Solve technology-specific fundamental problems associated with entire product lines and/or product classes using novel approaches to application process development, troubleshooting, and material characterization.
Travel:
Traveling of up to
10%
will be part of this role.
What Makes You a Good Fit (Required Qualifications)
Education:
Minimum of a
Bachelor’s degree
in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
Experience:
10+ years of experience
working in a chemical environment for semiconductor advanced packaging.
Technical Expertise: Good understanding of the latest
Semiconductor Packaging trends , especially
2.5D and 3D package .
Expertise in
wafer level encapsulation and molding process
in semiconductor package.
Communication:
Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.
Work Style:
Strong ownership and responsibility with a
customer-oriented mindset , effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.
Health Insurance:
Affordable plans for medical, dental, vision, and wellbeing starting on day 1.
Work-Life Balance:
Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.
Financial:
401k matching , employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.
Family Support:
12-week gender neutral parental leave
(up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.
Career Growth:
Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.
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Irvine, California, United States
$125,000 to $150,000 + Bonus + Full Benefits + Paid Relocation Overview
This role is for a
Principal Application Engineer
to join a global organization focused on innovation and cutting-edge material technologies within the Semiconductor Packaging or Adhesive Technologies space, specifically supporting the electronics market. The position involves providing high-level technical engineering support, developing in-depth application expertise, and directly engaging with key customers. Key Responsibilities
Technical Leadership:
Serve as the technical lead on developmental and commercialized products by optimizing material application processes.
Customer Interaction:
Directly interact with customers to troubleshoot and solve product and process-related problems.
Value Creation:
Ensure that new and existing products can be successfully employed by customers in a manner that brings clear and identifiable value.
Problem Solving:
Solve technology-specific fundamental problems associated with entire product lines and/or product classes using novel approaches to application process development, troubleshooting, and material characterization.
Travel:
Traveling of up to
10%
will be part of this role.
What Makes You a Good Fit (Required Qualifications)
Education:
Minimum of a
Bachelor’s degree
in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
Experience:
10+ years of experience
working in a chemical environment for semiconductor advanced packaging.
Technical Expertise: Good understanding of the latest
Semiconductor Packaging trends , especially
2.5D and 3D package .
Expertise in
wafer level encapsulation and molding process
in semiconductor package.
Communication:
Strong verbal communication skills (one-on-one and group presentations) with solid interpersonal skills.
Work Style:
Strong ownership and responsibility with a
customer-oriented mindset , effective in using project and time management skills to drive projects to completion, and the ability to work as a team member and independently.
Health Insurance:
Affordable plans for medical, dental, vision, and wellbeing starting on day 1.
Work-Life Balance:
Paid time off (sick, vacation, holiday, volunteer time), flexible & hybrid work policies (depending on role), and vacation buy / sell program.
Financial:
401k matching , employee share plan with voluntary investment / matching shares, annual performance bonus, service awards, and student loan reimbursement.
Family Support:
12-week gender neutral parental leave
(up to 20 weeks for parents giving birth), fertility support, adoption & surrogacy reimbursement, discounted child and elderly care, and scholarships.
Career Growth:
Diverse national and international growth opportunities, access to thousands of skills development courses, and tuition reimbursement.
#J-18808-Ljbffr