SPERTON - Where Great People Meet
Principal Application Engineer
SPERTON - Where Great People Meet, California, Missouri, United States, 65018
Base pay range
$120,000.00/yr - $155,000.00/yr Overview
A global leader in
adhesives, sealants, and functional coatings
is seeking a
Principal Application Engineer
to drive innovation in semiconductor materials. This role offers the chance to lead advanced technical projects, partner with leading electronics manufacturers, and shape the future of semiconductor packaging. What You’ll Do
Lead technical engineering for advanced adhesive and material products. Optimize material application processes to enhance performance and efficiency. Work directly with customers to troubleshoot and resolve product/process issues. Build expertise in semiconductor electronics and stay ahead of power packaging trends. Apply
statistical analysis
and
Design of Experiments (DOE)
to innovate and improve. Qualifications
Master’s degree in
Material Science, Mechanical Engineering, or Chemical Engineering . 10+ years of experience
in semiconductor materials. Strong knowledge of semiconductor packaging trends and processes. Proven experience in technical leadership and customer-facing roles. Skilled in statistical methods and DOE. What’s on Offer
Work at the forefront of semiconductor materials innovation Join a global leader with strong career growth opportunities
#J-18808-Ljbffr
$120,000.00/yr - $155,000.00/yr Overview
A global leader in
adhesives, sealants, and functional coatings
is seeking a
Principal Application Engineer
to drive innovation in semiconductor materials. This role offers the chance to lead advanced technical projects, partner with leading electronics manufacturers, and shape the future of semiconductor packaging. What You’ll Do
Lead technical engineering for advanced adhesive and material products. Optimize material application processes to enhance performance and efficiency. Work directly with customers to troubleshoot and resolve product/process issues. Build expertise in semiconductor electronics and stay ahead of power packaging trends. Apply
statistical analysis
and
Design of Experiments (DOE)
to innovate and improve. Qualifications
Master’s degree in
Material Science, Mechanical Engineering, or Chemical Engineering . 10+ years of experience
in semiconductor materials. Strong knowledge of semiconductor packaging trends and processes. Proven experience in technical leadership and customer-facing roles. Skilled in statistical methods and DOE. What’s on Offer
Work at the forefront of semiconductor materials innovation Join a global leader with strong career growth opportunities
#J-18808-Ljbffr