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NOKIA

Packaging Development Engineer

NOKIA, New York, New York, us, 10261

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Overview Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize electrical assembly and RF signal efficiency and ensure seamless transition to mass production. If you're eager to own the design and development of flip chip, fan out, semiconductor dicing, and reflow processes, while staying abreast of cutting-edge technologies, we encourage you to apply!

Responsibilities

Lead next generation Silicon Photonics package design in collaboration with cross-functional teams, stakeholders, and vendors to ensure package requirements are met.

Own the development of advanced packaging activities and designs: flip chip, reflow, fanout, thermo compression bonding, underfill, hot bar soldering, etc.

Optimize the assembly of electrical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.

Survey advanced SiPh packaging solutions, materials, and vendors to stay current with new technological advancements.

Own and maintain the process and manufacturing documentation, along with Bill of Materials for new products.

Drive package debug activities during product validation and qualification.

Support development activities at our Contract Manufacturers, both remotely and on-site, to ensure a smooth transition to mass production.

Qualifications

4-5 years of experience in high-speed electronics and Silicon Photonics package design.

Experience with flip chip, fanout, thermo compression bonding, underfill, hot bar soldering, and microelectronics packaging design.

Knowledgeable in packaging technologies and processes, including glass, ceramic, metal material properties and multilayer interfaces after bonding.

Experience documenting fabrication, inspection, and assembly processes.

Solid interpersonal, communication, and problem-solving skills to interact with engineering staff, external vendors, and contractors effectively.

Experience with package and process design/development from design to production.

Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging (or equivalent practical work experience).

Nice to have

Knowledgeable in materials properties, yield analysis, failure mode analysis, and quality tools (DOE, SPC, Six-Sigma).

Familiar with Industry Test Standards such as JEDEC, EIA, Telcordia, Mil-Std, etc.

Expertise in high-volume packaging of 2.5/3D packages and associated mechanical fabrication processes.

Familiar with optical coupling, fiber pigtail, and free space optics.

About Nokia Join us in creating the technology that helps the world act together.

We are a B2B technology innovation leader, pioneering networks that sense, think, and act, putting the world's people, machines, and devices in sync to create a more sustainable, productive and accessible future.

Learn more about life at Nokia.

About the Business Group A robust digital backbone is the unsung hero of modern life, underpinning everything from daily interactions to cloud computing and critical infrastructure. The Network Infrastructure team is passionate about pushing the boundaries of what's possible in networking, tackling the toughest challenges and delivering innovative solutions.

We deliver trusted, purpose-built IP, optical, fixed, and data center solutions that power the internet, drive the global economy, and support the mission-critical industries that keep the world running.

Our recruitment process We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

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