Nokia
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Packaging Development Engineer
role at
Nokia .
Job Overview We are seeking a talented Packaging Development Engineer to lead the development of next‑generation packaging solutions for high‑speed electronics and silicon photonics. The role focuses on optimizing electrical assembly and RF signal efficiency, ensuring seamless transition to mass production. You will own design and development of flip‑chip, fan‑out, semiconductor dicing, and reflow processes, while staying abreast of cutting‑edge technologies.
Responsibilities
Lead next‑generation Silicon Photonics package design in collaboration with cross‑functional teams, stakeholders and vendors to ensure package requirements are met.
Own all the development of advanced packaging activities and designs: flip chip, reflow, fanout, thermo‑compression bonding, underfill, hot‑bar soldering, etc.
Optimize electrical engine assembly applying Design for Manufacturing principles to meet production volumes and cost targets.
Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
Maintain process and manufacturing documentation, along with Bill of Materials for new products.
Drive package debug activities during product validation and qualification.
Support the development activities at our Contract Manufacturers, both remotely and on‑site, to ensure smooth transition to mass production.
Key Skills and Experience
4‑5 years of experience in high‑speed electronics and Silicon Photonics package design.
Experience with flip chip, fan‑out, thermo‑compression bonding, underfill, hot‑bar soldering; knowledge of microelectronics, optoelectronics packaging design and assembly.
Understanding of packaging technologies and processes, material properties, multilayer interfaces post‑bonding.
Documentation of fabrication, inspection and assembly processes.
Solid interpersonal, communication and problem‑solving skills to interact with engineering staff, external vendors and contractors.
Hands‑on experience with package and process design/development from design to production.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging or equivalent.
Additional Desired Experience
Knowledge of materials properties, yield analysis, failure mode analysis, quality tools (DOE, SPC, Six‑Sigma) and industry test standards (JEDEC, EIA, Telcordia, Mil‑Std).
Expertise in high‑volume packaging of 2.5/3 D packages and mechanical part fabrication processes.
Familiarity with optical coupling, fiber pigtail and free‑space optics.
About Nokia Join us in creating the technology that helps the world act together. We are a B2B technology innovation leader, pioneering networks that sense, think and act™, putting the world’s people, machines and devices in sync to create a more sustainable, productive and accessible future.
Benefits (USA)
Corporate Retirement Savings Plan
Health, dental and vision benefits
Short‑term and long‑term disability coverage
Life insurance and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program / Work Life Resource Program
Equal Opportunity Employer We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
#J-18808-Ljbffr
Packaging Development Engineer
role at
Nokia .
Job Overview We are seeking a talented Packaging Development Engineer to lead the development of next‑generation packaging solutions for high‑speed electronics and silicon photonics. The role focuses on optimizing electrical assembly and RF signal efficiency, ensuring seamless transition to mass production. You will own design and development of flip‑chip, fan‑out, semiconductor dicing, and reflow processes, while staying abreast of cutting‑edge technologies.
Responsibilities
Lead next‑generation Silicon Photonics package design in collaboration with cross‑functional teams, stakeholders and vendors to ensure package requirements are met.
Own all the development of advanced packaging activities and designs: flip chip, reflow, fanout, thermo‑compression bonding, underfill, hot‑bar soldering, etc.
Optimize electrical engine assembly applying Design for Manufacturing principles to meet production volumes and cost targets.
Survey advanced SiPh packaging solutions, materials and vendors to stay current with new technological advancements.
Maintain process and manufacturing documentation, along with Bill of Materials for new products.
Drive package debug activities during product validation and qualification.
Support the development activities at our Contract Manufacturers, both remotely and on‑site, to ensure smooth transition to mass production.
Key Skills and Experience
4‑5 years of experience in high‑speed electronics and Silicon Photonics package design.
Experience with flip chip, fan‑out, thermo‑compression bonding, underfill, hot‑bar soldering; knowledge of microelectronics, optoelectronics packaging design and assembly.
Understanding of packaging technologies and processes, material properties, multilayer interfaces post‑bonding.
Documentation of fabrication, inspection and assembly processes.
Solid interpersonal, communication and problem‑solving skills to interact with engineering staff, external vendors and contractors.
Hands‑on experience with package and process design/development from design to production.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging or equivalent.
Additional Desired Experience
Knowledge of materials properties, yield analysis, failure mode analysis, quality tools (DOE, SPC, Six‑Sigma) and industry test standards (JEDEC, EIA, Telcordia, Mil‑Std).
Expertise in high‑volume packaging of 2.5/3 D packages and mechanical part fabrication processes.
Familiarity with optical coupling, fiber pigtail and free‑space optics.
About Nokia Join us in creating the technology that helps the world act together. We are a B2B technology innovation leader, pioneering networks that sense, think and act™, putting the world’s people, machines and devices in sync to create a more sustainable, productive and accessible future.
Benefits (USA)
Corporate Retirement Savings Plan
Health, dental and vision benefits
Short‑term and long‑term disability coverage
Life insurance and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program / Work Life Resource Program
Equal Opportunity Employer We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.
If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.
#J-18808-Ljbffr