Northrop Grumman
Staff Process & Equipment Engineer (AMAT Tools) - R10208008
Northrop Grumman, Linthicum, Maryland, United States
Overview
Staff Process & Equipment Engineer (AMAT Tools) - R10208008 at Northrop Grumman Microelectronics Center (NGMC) for the Advanced Technology Lab (ATL) outside of Baltimore, Maryland. The role involves leading process and/or equipment engineering efforts utilizing Applied Materials tools (ENDURA, CENTURA dry etch and CVD, MIRRA), focusing on process optimization and improving equipment performance in collaboration with on-site AMAT FSO and engineering functions. What You’ll Get To Do
Lead process and/or equipment engineering efforts utilizing Applied Materials tools (ENDURA, CENTURA, MIRRA) to drive process optimization and enhance equipment performance. Collaborate with on-site AMAT FSO and engineering functions to improve operational metrics such as:
Process capability (CpK) Equipment availability Tool down escalations Maintenance ratio (M-ratio) Mean Time to Repair (MTTR) Mean Time Between Failures (MTBF) Preventive Maintenance (PM) success rate PM on-time and in-time metrics
Note: This position may qualify for Extended Work Week (EWW) compensation and a 9/80 work schedule, subject to management discretion and business needs. Provide informal guidance to process and equipment engineers while directing Customer Engineers (CEs) in both conference room and hands-on settings. Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals and process BKMs. Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders (Operations, Process Engineering, Equipment Engineering, site director). Analyze equipment performance and troubleshoot issues using data-based methodologies to enhance yield and efficiency. Lead process optimization initiatives to resolve on-wafer issues and diagnose equipment malfunctions. Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools. Basic Qualifications
Bachelor’s degree in a STEM discipline with 12+ years of related experience; or Master’s degree in a STEM discipline with 10 years of related experience. Experience leading OEMs and/or high-volume manufacturing fabs. Proven expertise with 200mm or 300mm semiconductor equipment (ENDURA, CENTURA, PRODUCER, MIRRA). Strong analytical and problem-solving skills; able to work independently and in teams. Experience leading projects, mentoring colleagues, and fostering continuous improvement. Ability to perform equipment and process partitioning to resolve hardware and process issues (e.g., failing mechanical/inf ilm defects, high film uniformity, etc.). Skilled at interpreting and modifying diagrams/schematics to troubleshoot hardware issues. US citizenship and ability to obtain/maintain DoD Top Secret/SCI clearance with Poly. Preferred Qualifications
Expertise with Applied Materials equipment, including hardware configurations, calibration parameters, and process variables. Strong understanding of experimental design methodologies (full factorial and fractional factorial designs). Experience configuring and troubleshooting ENDURA mainframe and process chambers for process optimization and throughput. Experience with Centura etch eMXP+ systems for high-aspect-ratio etches on silicon, metal, and dielectrics. Experience with Centura CVD to deposit high-quality SiOx and SiN films, including hardware/process modifications. Experience with MIRRA DESICA CMP for automated planarization, including endpoint detection, metal damascene and dielectric planarization, and knowledge of slurry chemistry and pad conditioning. Compensation & Benefits
Primary Level Salary Range: $163,200.00 - $244,800.00. Northrop Grumman considers multiple factors when determining base salary offers, including scope, candidate experience, education, skills, and market conditions. Eligible for overtime, shift differential, discretionary bonuses, and potentially Long Term Incentives depending on role and level. Benefits include health insurance, life and disability insurance, savings plan, company holidays, and paid time off. Additional Information
The application period for the job is estimated to be 20 days from the posting date, subject to change based on business needs and qualified candidates. Northrop Grumman is an Equal Opportunity Employer. U.S. Citizenship is required for positions with government clearance or other restricted roles. For the complete EEO and pay transparency statement, visit http://www.northropgrumman.com/EEO. Location & Seniority
Seniority level: Mid-Senior level Employment type: Full-time Job function: Engineering and Information Technology Industries: Defense and Space Manufacturing
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Staff Process & Equipment Engineer (AMAT Tools) - R10208008 at Northrop Grumman Microelectronics Center (NGMC) for the Advanced Technology Lab (ATL) outside of Baltimore, Maryland. The role involves leading process and/or equipment engineering efforts utilizing Applied Materials tools (ENDURA, CENTURA dry etch and CVD, MIRRA), focusing on process optimization and improving equipment performance in collaboration with on-site AMAT FSO and engineering functions. What You’ll Get To Do
Lead process and/or equipment engineering efforts utilizing Applied Materials tools (ENDURA, CENTURA, MIRRA) to drive process optimization and enhance equipment performance. Collaborate with on-site AMAT FSO and engineering functions to improve operational metrics such as:
Process capability (CpK) Equipment availability Tool down escalations Maintenance ratio (M-ratio) Mean Time to Repair (MTTR) Mean Time Between Failures (MTBF) Preventive Maintenance (PM) success rate PM on-time and in-time metrics
Note: This position may qualify for Extended Work Week (EWW) compensation and a 9/80 work schedule, subject to management discretion and business needs. Provide informal guidance to process and equipment engineers while directing Customer Engineers (CEs) in both conference room and hands-on settings. Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals and process BKMs. Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders (Operations, Process Engineering, Equipment Engineering, site director). Analyze equipment performance and troubleshoot issues using data-based methodologies to enhance yield and efficiency. Lead process optimization initiatives to resolve on-wafer issues and diagnose equipment malfunctions. Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools. Basic Qualifications
Bachelor’s degree in a STEM discipline with 12+ years of related experience; or Master’s degree in a STEM discipline with 10 years of related experience. Experience leading OEMs and/or high-volume manufacturing fabs. Proven expertise with 200mm or 300mm semiconductor equipment (ENDURA, CENTURA, PRODUCER, MIRRA). Strong analytical and problem-solving skills; able to work independently and in teams. Experience leading projects, mentoring colleagues, and fostering continuous improvement. Ability to perform equipment and process partitioning to resolve hardware and process issues (e.g., failing mechanical/inf ilm defects, high film uniformity, etc.). Skilled at interpreting and modifying diagrams/schematics to troubleshoot hardware issues. US citizenship and ability to obtain/maintain DoD Top Secret/SCI clearance with Poly. Preferred Qualifications
Expertise with Applied Materials equipment, including hardware configurations, calibration parameters, and process variables. Strong understanding of experimental design methodologies (full factorial and fractional factorial designs). Experience configuring and troubleshooting ENDURA mainframe and process chambers for process optimization and throughput. Experience with Centura etch eMXP+ systems for high-aspect-ratio etches on silicon, metal, and dielectrics. Experience with Centura CVD to deposit high-quality SiOx and SiN films, including hardware/process modifications. Experience with MIRRA DESICA CMP for automated planarization, including endpoint detection, metal damascene and dielectric planarization, and knowledge of slurry chemistry and pad conditioning. Compensation & Benefits
Primary Level Salary Range: $163,200.00 - $244,800.00. Northrop Grumman considers multiple factors when determining base salary offers, including scope, candidate experience, education, skills, and market conditions. Eligible for overtime, shift differential, discretionary bonuses, and potentially Long Term Incentives depending on role and level. Benefits include health insurance, life and disability insurance, savings plan, company holidays, and paid time off. Additional Information
The application period for the job is estimated to be 20 days from the posting date, subject to change based on business needs and qualified candidates. Northrop Grumman is an Equal Opportunity Employer. U.S. Citizenship is required for positions with government clearance or other restricted roles. For the complete EEO and pay transparency statement, visit http://www.northropgrumman.com/EEO. Location & Seniority
Seniority level: Mid-Senior level Employment type: Full-time Job function: Engineering and Information Technology Industries: Defense and Space Manufacturing
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