Northrop Grumman
Staff Process & Equipment Engineer (AMAT Tools)
Northrop Grumman, Linthicum, Maryland, United States
RELOCATION ASSISTANCE: Relocation assistance may be availableCLEARANCE TYPE: SCITRAVEL: Yes, 10% of the Time
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Microelectronics Center (NGMC)
of Mission Systems
is seeking
a
Staff Process & Equipment Engineer (AMAT Tools)
for our Advanced Technology Lab (ATL) -
located
outside of
Baltimore, Maryland
– where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. What You’ll get to Do: Lead process and/or equipment engineering efforts
utilizing
Applied Materials tools
, a
combination of
ENDURA, CENTURA (
dry etch and CVD
)
and
MIRRA platforms
.
This position
will focus on
driving
process optimization and enhancing
equipment
performance by collaborating with
on-site
AMAT
FSO
and
engineering functions.
In this role you
will focus on
improv
ing
various operational metrics, including: Process capability (
CpK
)
Equipment
availability
Tool down escalations
Maintenance ratio (M-ratio)
Mean Time to Repair (MTTR)
Mean Time Between Failures (MTBF)
Preventive Maintenance (PM) success rate
PM on-time and in-time metrics
This position may qualify for
Extended Work Week (EWW) compensation , which provides straight time pay at the regular hourly rate for authorized hours worked beyond 80 in a biweekly pay period. EWW eligibility and approval are determined by management discretion and business needs. Additionally, a
9/80 work schedule
may be available, allowing for a day off every two weeks while maintaining full-time hours to support work-life balance. Both EWW and alternative work schedules are subject to review and may change based on customer requirements and evolving business priorities Key Responsibilities: Provide
informal guidance to
process and equipment engineers
while
collaborating
and
directing
Customer Engineers (CEs) in both
conference room
and hands-on settings.
Create and review documents covering technical improvements, system upgrades, support plans, maintenance
manuals
and process Best Known Methods (BKMs).
Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders such as Operations, Process Engineering, Equipment Engineering, and site director.
Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency.
Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment malfunctions.
Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools.
Basic Qualifications: Bachelor’s degree in a STEM discipline (Science, Technology, Engineering, or Math) and 12+ years of related experience; or
Master's
degree in a STEM discipline and 10 years of related experience.
Prior experience with leading OEMs and/or HVM fabs.
Proven
expertise
with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms.
Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment.
Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement.
Able to create and perform equipment and process partitioning to resolve hardware and/or process issues, such as
failing
mechanical
and
infilm
defects,
high
film
uniformity,
failing VPD
,
and more.
Skilled in interpreting and
modifying
diagrams and schematics to effectively troubleshoot and resolve
hardware
issues
.
US citizenship and
ability to
obtain and
maintain
a DoD Top Secret/SCI clearance with Poly
required.
Preferred Qualifications: Expertise
in fingerprinting a wide range of Applied Materials equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables.
Strong understanding of experimental design methodologies, specifically full
factorial
and fractional factorial designs.
Expertise
in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput.
Expertise
in Centura etch
eMXP
+ systems, specializing in high-aspect-ratio etches on silicon, metal, and dielectrics.
Expertise
in Centura CVD platforms
to
deposit
high quality
SIOx
and
SiN
films, including modifying hardware and/or
process
.
Expertise
in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing,
expertise
in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning.
Primary Level Salary Range: $163,200.00 - $244,800.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions. #J-18808-Ljbffr
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Microelectronics Center (NGMC)
of Mission Systems
is seeking
a
Staff Process & Equipment Engineer (AMAT Tools)
for our Advanced Technology Lab (ATL) -
located
outside of
Baltimore, Maryland
– where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. What You’ll get to Do: Lead process and/or equipment engineering efforts
utilizing
Applied Materials tools
, a
combination of
ENDURA, CENTURA (
dry etch and CVD
)
and
MIRRA platforms
.
This position
will focus on
driving
process optimization and enhancing
equipment
performance by collaborating with
on-site
AMAT
FSO
and
engineering functions.
In this role you
will focus on
improv
ing
various operational metrics, including: Process capability (
CpK
)
Equipment
availability
Tool down escalations
Maintenance ratio (M-ratio)
Mean Time to Repair (MTTR)
Mean Time Between Failures (MTBF)
Preventive Maintenance (PM) success rate
PM on-time and in-time metrics
This position may qualify for
Extended Work Week (EWW) compensation , which provides straight time pay at the regular hourly rate for authorized hours worked beyond 80 in a biweekly pay period. EWW eligibility and approval are determined by management discretion and business needs. Additionally, a
9/80 work schedule
may be available, allowing for a day off every two weeks while maintaining full-time hours to support work-life balance. Both EWW and alternative work schedules are subject to review and may change based on customer requirements and evolving business priorities Key Responsibilities: Provide
informal guidance to
process and equipment engineers
while
collaborating
and
directing
Customer Engineers (CEs) in both
conference room
and hands-on settings.
Create and review documents covering technical improvements, system upgrades, support plans, maintenance
manuals
and process Best Known Methods (BKMs).
Serve as the primary point of contact for tool downtime escalations, liaising between Applied Materials and internal stakeholders such as Operations, Process Engineering, Equipment Engineering, and site director.
Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency.
Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment malfunctions.
Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools.
Basic Qualifications: Bachelor’s degree in a STEM discipline (Science, Technology, Engineering, or Math) and 12+ years of related experience; or
Master's
degree in a STEM discipline and 10 years of related experience.
Prior experience with leading OEMs and/or HVM fabs.
Proven
expertise
with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms.
Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment.
Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement.
Able to create and perform equipment and process partitioning to resolve hardware and/or process issues, such as
failing
mechanical
and
infilm
defects,
high
film
uniformity,
failing VPD
,
and more.
Skilled in interpreting and
modifying
diagrams and schematics to effectively troubleshoot and resolve
hardware
issues
.
US citizenship and
ability to
obtain and
maintain
a DoD Top Secret/SCI clearance with Poly
required.
Preferred Qualifications: Expertise
in fingerprinting a wide range of Applied Materials equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables.
Strong understanding of experimental design methodologies, specifically full
factorial
and fractional factorial designs.
Expertise
in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput.
Expertise
in Centura etch
eMXP
+ systems, specializing in high-aspect-ratio etches on silicon, metal, and dielectrics.
Expertise
in Centura CVD platforms
to
deposit
high quality
SIOx
and
SiN
films, including modifying hardware and/or
process
.
Expertise
in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing,
expertise
in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning.
Primary Level Salary Range: $163,200.00 - $244,800.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions. #J-18808-Ljbffr