Google
Microelectronics Numerical Simulation Engineer
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You\'ll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. We make Google\'s product portfolio possible and are committed to building and maintaining high-performance hardware and software platforms.
Responsibilities
Partner with stakeholders internally and externally to develop numerical models that help in understanding material, configuration, manufacturing, and reliability trade-offs in electronic assemblies.
Develop numerical models to capture different failure modes and physical phenomena expected during the entire microelectronics device lifecycle: design, manufacturing, assembly, testing, and field operation.
Partner with thermal, packaging, test, manufacturing, reliability and quality engineers to develop validated simulation-based design guidelines to ensure deployment of microelectronics assemblies.
Design and develop test vehicles to generate experimental data required for model validation and enhancement.
Participate in the development of roadmaps for materials, models and infrastructure required for numerical models in local and cloud-based simulation environments. Attend conferences, standards bodies and related industry forums to stay updated on the latest developments in numerical analysis.
Qualifications Minimum qualifications:
Bachelor\'s degree in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
8 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages/tools such as ANSYS (APDL, Workbench, Icepak), Flotherm, LS-Dyna, Abaqus, Fluent, Matlab, Python.
Experience in thermomechanical reliability and mechanical drop or shock simulation.
Experience with Statistical Software tools (e.g., JMP, Weibull++, SPSS).
Preferred qualifications:
Master\'s degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
Experience in setting up manufacturing assembly processes, driving product launches and assembly process optimization within manufacturing operations.
Experience in technical leadership, project management, and executive communication.
Experience in Coupled Field/Multiphysics, Thermal-Electric simulations, Fluid-Solid Interaction.
Experience in reliability prediction models, stochastic simulations, uncertainty analysis, multi-scale and multiobjective optimization.
Benefits and Additional Information The US base salary range for this full-time position is $138,000-$202,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Compensation details reflect base salary only and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google\'s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.
Seniority level: Not Applicable
Employment type: Full-time
Job function: Other, Information Technology, and Engineering
Industries: Information Services and Technology, Information and Internet
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Responsibilities
Partner with stakeholders internally and externally to develop numerical models that help in understanding material, configuration, manufacturing, and reliability trade-offs in electronic assemblies.
Develop numerical models to capture different failure modes and physical phenomena expected during the entire microelectronics device lifecycle: design, manufacturing, assembly, testing, and field operation.
Partner with thermal, packaging, test, manufacturing, reliability and quality engineers to develop validated simulation-based design guidelines to ensure deployment of microelectronics assemblies.
Design and develop test vehicles to generate experimental data required for model validation and enhancement.
Participate in the development of roadmaps for materials, models and infrastructure required for numerical models in local and cloud-based simulation environments. Attend conferences, standards bodies and related industry forums to stay updated on the latest developments in numerical analysis.
Qualifications Minimum qualifications:
Bachelor\'s degree in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
8 years of experience in microelectronics packaging (e.g., multi-chip modules, silicon photonics).
Experience with Finite Element Analysis and Computational Fluid Dynamics and programming languages/tools such as ANSYS (APDL, Workbench, Icepak), Flotherm, LS-Dyna, Abaqus, Fluent, Matlab, Python.
Experience in thermomechanical reliability and mechanical drop or shock simulation.
Experience with Statistical Software tools (e.g., JMP, Weibull++, SPSS).
Preferred qualifications:
Master\'s degree or PhD in Electrical, Mechanical, Industrial, Materials, or a related engineering field.
Experience in setting up manufacturing assembly processes, driving product launches and assembly process optimization within manufacturing operations.
Experience in technical leadership, project management, and executive communication.
Experience in Coupled Field/Multiphysics, Thermal-Electric simulations, Fluid-Solid Interaction.
Experience in reliability prediction models, stochastic simulations, uncertainty analysis, multi-scale and multiobjective optimization.
Benefits and Additional Information The US base salary range for this full-time position is $138,000-$202,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Compensation details reflect base salary only and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google\'s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.
Seniority level: Not Applicable
Employment type: Full-time
Job function: Other, Information Technology, and Engineering
Industries: Information Services and Technology, Information and Internet
Referrals increase your chances of interviewing at Google by 2x
#J-18808-Ljbffr