Principal Application Engineer – Semiconductor Advanced Package

Principal Application Engineer – Semiconductor Advanced Package

Principal Application Engineer - Semiconductor Advanced Package Irvine, California, Full Time. You will join our business unit, working with advanced packaging materials (adhesives, sealants, functional coatings) targeted at the semiconductor industry. As a Principal Application Engineer, you will lead on both developmental and commercial products in semiconductor advanced packaging. You will serve as a technical authority on material application processes (wafer-level encapsulation, molding, etc.), collaborate with customers to solve process challenges, and drive adoption of new and existing solutions with clear value. You will engage across R&D, manufacturing, and customer sites to ensure products meet performance requirements and are successfully integrated into customer processes. Key Responsibilities / Duties Serve as technical lead for advanced packaging product lines: troubleshoot, optimize, and validate material application processes Provide deep application knowledge in semiconductor packaging (2.5D, 3D, via, interposer, etc.) Interface directly with customers to resolve product- or process-related issues, working hands-on to test and develop solutions Design experiments, run tests, and analyze data for material behavior, reliability, and process compatibility Ensure new and existing products deliver quantifiable value to customers (yield, throughput, cost) Solve fundamental technical challenges across product families using Client approaches Collaborate with internal teams (R&D, process engineering, quality, manufacturing) to transfer successful technologies Maintain expertise on industry trends in advanced packaging, materials, and processes Travel to customer sites or partner locations (up to 10%) as needed Required Qualifications & Skills Bachelor's degree in Materials Science / Engineering, Chemical Engineering, Mechanical Engineering, or related field 10+ years experience in semiconductor advanced packaging environment (materials, adhesives, encapsulants, molding) Strong understanding of 2.5D / 3D packaging, wafer-level encapsulation, molding, underfills, interconnects, etc. Proven track record in taking a product from development through customer implementation Strong experimental design, analytical, problem-solving, and characterization skills Excellent verbal and written communication, able to interact with customers and present in group settings Ability to work independently and cross-functionally in a fast-paced environment High ownership, customer-oriented mindset, and ability to translate customer needs into technical solutions Proficiency with project management, time management, and meeting deliverables Willingness to travel up to 10%

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