General Motors is hiring: Principal Hardware Architect – Platform Architecture i

Principal Hardware Architect – Platform Architecture

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Job Description

General Motors is redefining mobility with electrification, autonomous driving, and software‑defined vehicle platforms. Our Hardware Architecture team develops the next generation of zonal and centralized compute architectures. We seek a Principal Hardware Architect with deep expertise in vehicle E/E systems, semiconductor technology, and high‑speed hardware design to lead the definition and optimization of our future hardware platforms.

Location & Flexibility

This role is hybrid. The successful candidate is expected to report to Mountain View, CA or Warren, MI three times per week.

The Role

As a Principal Hardware Architect, you will define and drive the hardware architecture for GM’s next‑generation zonal and centralized vehicle platforms.

Responsibilities

• Define and evolve GM’s zonal hardware architecture, balancing performance, cost, scalability, and reliability.
• Lead trade‑off analysis across compute partitioning, networking, harnessing, and ECU design.
• Translate semiconductor technology roadmaps into platform‑level hardware requirements.
• Define physical layer network topology and constraints for in‑vehicle communication (Ethernet, CAN, LIN, PCIe, etc.).
• Decompose system‑level requirements into ECU‑ and harness‑level specifications.
• Provide guidance on high‑speed PCB design and layout best practices.
• Partner with vehicle architecture, system architecture, software, and semiconductor teams to ensure cohesive system design.
• Influence supplier and technology partner roadmaps to align with GM’s long‑term strategy.
• Drive adoption of new technologies, tools, and methodologies in hardware architecture.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• 12+ years of experience in hardware/system architecture, with significant experience in automotive or other high‑reliability industries.
• Proven track record of defining and delivering complex hardware architectures at scale.
• Deep understanding of zonal architectures and vehicle E/E trade‑offs.
• Strong knowledge of software partitioning on microprocessors and its hardware implications.
• Expertise in physical layer network topology (Ethernet, CAN, LIN, PCIe, SerDes) and constraints.
• Ability to map semiconductor technology capabilities to physical‑layer and harness requirements.
• Strong background in high‑speed PCB design and layout.
• Excellent communication skills and ability to influence cross‑functional teams.
• Experience mentoring and guiding engineering teams.

Compensation

The base compensation range is $228,900 – $350,500. Additional incentive pay and benefits are provided.

Benefits

GM offers a variety of health and wellbeing benefit programs, including medical, dental, vision, health savings account, flexible spending accounts, retirement savings plan, life insurance, paid vacation, tuition assistance, employee assistance program, and general motor vehicle discounts.

About GM

GM’s vision is a world with zero crashes, zero emissions, and zero congestion. We are committed to fostering an inclusive workplace.

Equal Employment Opportunity

General Motors is committed to a workplace free of unlawful discrimination. All employment decisions are made on a non‑discriminatory basis without regard to sex, race, color, national origin, citizenship status, religion, age, disability, pregnancy, sexual orientation, gender identity, veteran status, or any other protected status in accordance with federal, state, and local laws.

Accommodations

Individuals with disabilities may request reasonable accommodations to assist with job search or application. Contact 800‑865‑7580 or email GM.