Alpha & Omega Semiconductor
Principal Packaging Engineer
Alpha & Omega Semiconductor, San Francisco, California, United States, 94199
Alpha and Omega Semiconductor (AOS) designs, develops, and globally supplies a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT, IPM, TVS, GaN/SiC, Power IC, and Digital Power products. Our products underpin everyday applications such as personal computers, graphic cards, gaming consoles, TVs, home appliances, smartphones, power tools, and more. At the center of our innovation is a collaborative, talent-driven atmosphere that fuels growth and advancement opportunities.
Base pay range $170,000.00/yr - $220,000.00/yr
Overall Purpose of Position: To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.
Primary Job Responsibilities
Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP.
Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.
Qualifications
10+ years of experience in Power Electronics package design (Si, GaN, SiC; LF based, substrate based).
MS degree and above.
Experience in AutoCAD and SoldWorks for package designs.
Experience with Ansys for thermal and stress simulation.
Experience in RD concept development and novel power electronics packaging technologies.
Experience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and molding).
Experience in MIS substrate design and IPM design is a plus.
Professional communication in technical subjects with internal and external groups.
Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, age, color, ethnicity, marital status, sex, religion, national origin, sexual orientation, gender, gender identity, disability, protected veteran status or any other category protected by federal, state or local law.
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Base pay range $170,000.00/yr - $220,000.00/yr
Overall Purpose of Position: To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.
Primary Job Responsibilities
Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP.
Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.
Qualifications
10+ years of experience in Power Electronics package design (Si, GaN, SiC; LF based, substrate based).
MS degree and above.
Experience in AutoCAD and SoldWorks for package designs.
Experience with Ansys for thermal and stress simulation.
Experience in RD concept development and novel power electronics packaging technologies.
Experience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and molding).
Experience in MIS substrate design and IPM design is a plus.
Professional communication in technical subjects with internal and external groups.
Alpha and Omega Semiconductor, Inc is committed to diversity in our workplace. Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, age, color, ethnicity, marital status, sex, religion, national origin, sexual orientation, gender, gender identity, disability, protected veteran status or any other category protected by federal, state or local law.
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