The University of Texas at Austin
Design Engineering Manager, Texas Institute for Electronics
The University of Texas at Austin, Campus, Illinois, us, 60920
Job Posting Title:
Design Engineering Manager, Texas Institute for Electronics Location:
PICKLE RESEARCH CAMPUS Overview
The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and support multi-material (Silicon, III-V, Glass) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities. Responsibilities
Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems. Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities. Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages. Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility. Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies. Other related functions as assigned. Required Qualifications
Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field 10+ years of relevant industry experience in semiconductor IC design Previous supervisory experience with small to medium-sized teams Strong understanding of semiconductor device physics and mixed signal circuit design Excellent problem-solving skills and attention to detail Strong communication and teamwork skills Ability to manage multiple projects in a fast-paced environment Proficiency in industry-standard EDA software for circuit and/or package design Preferred Qualifications
Master's or higher degree in relevant semiconductor engineering fields Experience with 2.5D and 3D semiconductor packaging technologies Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging) Strong background in DFT/DFM methodologies and BIST techniques Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF) Experience in a startup or R&D environment Salary Range
TIE Pays Industry Competitive Salaries Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card For more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human Resources Equal Opportunity Employer
The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions. Pay Transparency
The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant.
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Design Engineering Manager, Texas Institute for Electronics Location:
PICKLE RESEARCH CAMPUS Overview
The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and support multi-material (Silicon, III-V, Glass) and multi-domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities. Responsibilities
Supervise, guide, direct, and help train team of TIE Design Engineers through hands-on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE's 3D-ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi-chiplet, heterogeneous micro-systems. Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities. Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages. Participate in industry 'design standards' workshops and consortiums. Collaborate with internal and external design teams on package compatibility. Design and execute experiments for packaging performance optimization. Conduct multi-physics modeling and simulation studies. Stay current with industry trends and emerging technologies. Other related functions as assigned. Required Qualifications
Bachelor's degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field 10+ years of relevant industry experience in semiconductor IC design Previous supervisory experience with small to medium-sized teams Strong understanding of semiconductor device physics and mixed signal circuit design Excellent problem-solving skills and attention to detail Strong communication and teamwork skills Ability to manage multiple projects in a fast-paced environment Proficiency in industry-standard EDA software for circuit and/or package design Preferred Qualifications
Master's or higher degree in relevant semiconductor engineering fields Experience with 2.5D and 3D semiconductor packaging technologies Solid understanding of various packaging technologies (wire bonding, flip-chip, wafer-level packaging) Strong background in DFT/DFM methodologies and BIST techniques Experience in multi-physics modeling (Power, Thermal, Mechanical, Signal Integrity, RF) Experience in a startup or R&D environment Salary Range
TIE Pays Industry Competitive Salaries Benefits
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card For more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human Resources Equal Opportunity Employer
The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions. Pay Transparency
The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant.
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