The University of Texas at Austin
Senior or Principal Product Manager, Texas Institute for Electronics
The University of Texas at Austin, Campus, Illinois, us, 60920
Job Details
Job Title:
Senior or Principal Product Manager, Texas Institute for Electronics Location:
AUSTIN, TX Location notes:
Hybrid work arrangements may be possible; travel up to 30–50% as needed. Overview
Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. Our Mission A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems—catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Our Impact Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. Our Technology Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact. UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages that include: Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on UT Shuttle and CapMetro buses with staff ID card For more details, see Benefits | Human Resources and UT Austin Employee Experience | Human Resources
Purpose
The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.
Responsibilities Own the product strategy and roadmap
for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. Serve as the bridge between technical teams and customer requirements to drive product success.
Author and maintain comprehensive Product Requirements Documents (PRDs)
that guide process development, EDA integration, and packaging engineering teams. Ensure stakeholders have a clear blueprint so development remains aligned and efficient.
Drive cross-functional collaboration
across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure features and releases are cohesive and aligned with strategy.
Engage with customers and industry partners
to align capabilities with evolving industry needs. Represent TIE in technical discussions, gather feedback, and form strategic partnerships that enhance the platform and ecosystem.
Serve as a technical champion for 2.5D/3D integration —guide internal decisions and act as a liaison in customer design reviews and industry forums.
Develop and execute detailed program plans
covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of milestones.
Create technical documentation and collateral
such as integration guidelines, reference designs, and user guides to support customer design teams.
Monitor market trends and competitive developments
to inform product positioning, feature prioritization, and differentiation.
Champion accountability and transparency
across all product workstreams, ensuring stakeholders are informed and commitments are met.
Other related functions as assigned.
Required Qualifications Education:
BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
Experience:
Senior Product Manager: 5+ years in semiconductor packaging, microsystems integration, or related microelectronics product development; Principal Product Manager: 10+ years in semiconductor packaging, microsystems integration, or related microelectronics product development.
Technical Expertise:
Deep knowledge of advanced packaging technologies (e.g., 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration; experience with modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
Process & EDA:
Working knowledge of semiconductor fabrication processes and EDA flows for PDK/ADK creation and integration with major EDA vendor flows.
Communication:
Exceptional ability to simplify complex concepts and communicate with technical and business stakeholders.
Startup DNA & Execution:
Ability to operate with ambiguity, act with urgency, and drive progress in a fast-paced environment without heavy management layers.
Location:
Austin, Texas preferred; hybrid work possible with 30–50% travel; subject to policies and approvals.
Relevant education and experience may be substituted as appropriate.
Preferred Qualifications Advanced Degree:
MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or related field.
Program Leadership:
End-to-end ownership of complex programs with multiple stakeholders, defining success metrics and managing interdependencies.
Vendor/Partner Management:
Experience managing subcontractors or external partners to meet milestones.
Industry Background:
Prior experience at a leading semiconductor foundry or packaging house is a plus.
Ready to Make Your Mark?
If you’re excited to push the boundaries of microsystems innovation and lead ambitious programs with industry-shaping partners, let’s talk. Help build the future of microelectronics with TIE.
Salary & Benefits
TIE pays industry-competitive salaries and provides comprehensive benefits as described above.
Working Conditions
May work around standard office conditions Repetitive keyboard use at a workstation Use of manual dexterity (e.g., using a mouse)
Work Schedule
Monday - Friday Occasional/frequent nights/weekends required
Required Materials
Resume/CV 3 work references with contact information (at least one from a supervisor) Letter of interest (optional)
Eligibility & Compliance
Employment Eligibility: Regular staff who have been employed in their current position for the last six months may apply for openings recruited University-wide or via open recruiting. Current university employees must apply within Workday. Retirement Plan Eligibility: TRS with optional ORP depending on hours and length. Background Checks: A criminal history background check will be required for finalist(s). Equal Opportunity Employer: The University of Texas at Austin is an equal opportunity/affirmative action employer and prohibits discrimination. Pay Transparency: The university complies with pay transparency requirements. Employment Eligibility Verification: If hired, you will complete the I-9 form and present acceptable documents. E-Verify: UT Austin uses E-Verify; company ID 854197. See E-Verify and Right to Work posters for details.
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Job Title:
Senior or Principal Product Manager, Texas Institute for Electronics Location:
AUSTIN, TX Location notes:
Hybrid work arrangements may be possible; travel up to 30–50% as needed. Overview
Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. Our Mission A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems—catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Our Impact Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. Our Technology Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact. UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages that include: Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on UT Shuttle and CapMetro buses with staff ID card For more details, see Benefits | Human Resources and UT Austin Employee Experience | Human Resources
Purpose
The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.
Responsibilities Own the product strategy and roadmap
for TIE’s advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. Serve as the bridge between technical teams and customer requirements to drive product success.
Author and maintain comprehensive Product Requirements Documents (PRDs)
that guide process development, EDA integration, and packaging engineering teams. Ensure stakeholders have a clear blueprint so development remains aligned and efficient.
Drive cross-functional collaboration
across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure features and releases are cohesive and aligned with strategy.
Engage with customers and industry partners
to align capabilities with evolving industry needs. Represent TIE in technical discussions, gather feedback, and form strategic partnerships that enhance the platform and ecosystem.
Serve as a technical champion for 2.5D/3D integration —guide internal decisions and act as a liaison in customer design reviews and industry forums.
Develop and execute detailed program plans
covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of milestones.
Create technical documentation and collateral
such as integration guidelines, reference designs, and user guides to support customer design teams.
Monitor market trends and competitive developments
to inform product positioning, feature prioritization, and differentiation.
Champion accountability and transparency
across all product workstreams, ensuring stakeholders are informed and commitments are met.
Other related functions as assigned.
Required Qualifications Education:
BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
Experience:
Senior Product Manager: 5+ years in semiconductor packaging, microsystems integration, or related microelectronics product development; Principal Product Manager: 10+ years in semiconductor packaging, microsystems integration, or related microelectronics product development.
Technical Expertise:
Deep knowledge of advanced packaging technologies (e.g., 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration; experience with modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
Process & EDA:
Working knowledge of semiconductor fabrication processes and EDA flows for PDK/ADK creation and integration with major EDA vendor flows.
Communication:
Exceptional ability to simplify complex concepts and communicate with technical and business stakeholders.
Startup DNA & Execution:
Ability to operate with ambiguity, act with urgency, and drive progress in a fast-paced environment without heavy management layers.
Location:
Austin, Texas preferred; hybrid work possible with 30–50% travel; subject to policies and approvals.
Relevant education and experience may be substituted as appropriate.
Preferred Qualifications Advanced Degree:
MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or related field.
Program Leadership:
End-to-end ownership of complex programs with multiple stakeholders, defining success metrics and managing interdependencies.
Vendor/Partner Management:
Experience managing subcontractors or external partners to meet milestones.
Industry Background:
Prior experience at a leading semiconductor foundry or packaging house is a plus.
Ready to Make Your Mark?
If you’re excited to push the boundaries of microsystems innovation and lead ambitious programs with industry-shaping partners, let’s talk. Help build the future of microelectronics with TIE.
Salary & Benefits
TIE pays industry-competitive salaries and provides comprehensive benefits as described above.
Working Conditions
May work around standard office conditions Repetitive keyboard use at a workstation Use of manual dexterity (e.g., using a mouse)
Work Schedule
Monday - Friday Occasional/frequent nights/weekends required
Required Materials
Resume/CV 3 work references with contact information (at least one from a supervisor) Letter of interest (optional)
Eligibility & Compliance
Employment Eligibility: Regular staff who have been employed in their current position for the last six months may apply for openings recruited University-wide or via open recruiting. Current university employees must apply within Workday. Retirement Plan Eligibility: TRS with optional ORP depending on hours and length. Background Checks: A criminal history background check will be required for finalist(s). Equal Opportunity Employer: The University of Texas at Austin is an equal opportunity/affirmative action employer and prohibits discrimination. Pay Transparency: The university complies with pay transparency requirements. Employment Eligibility Verification: If hired, you will complete the I-9 form and present acceptable documents. E-Verify: UT Austin uses E-Verify; company ID 854197. See E-Verify and Right to Work posters for details.
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