Lockheed Martin
ElectroMechanical Packaging design engineer
Lockheed Martin, Dallas, Texas, United States, 75215
Lockheed Martin - ElectroMechanical Packaging Design Engineer
Lockheed Martin is seeking an experienced
ElectroMechanical Packaging Design Engineer
to join their team in Dallas, Texas. This is a full-time, first shift position with potential for relocation. Job Description:
This role involves hardware development of military electronics within flight-worthy assemblies. The engineer will collaborate with cross-functional teams to complete hardware designs and support integration efforts for the designated electronic system. Key Responsibilities:
Design and develop hardware for military electronics, including processors, interface electronics, power cards, and flexes. Work within physical and thermal constraints, requiring experience with high-density electronic packaging. Create and demonstrate reference designs to support multiple contract wins within the RF Center of Excellence. Collaborate with cross-functional teams for seamless hardware integration. Qualifications:
Basic Qualifications:
Secret Clearance Design experience with PWBs / CCAs and harnesses Proficiency with Pro-E/Creo, Windchill, and LM design processes Bachelor’s degree in an engineering or related field Experience in Electronic Packaging and Military Defense design Desired Skills:
Experience as a Packaging Lead Knowledge of CREO Experience with PWBs, CCAs, and Harnesses RF packaging Design Experience AutoCAD experience Zuken E3 Experience Additional Information:
US Citizenship is mandatory due to security clearance requirements Part-time remote telework available; details discussed during hiring Flexible work schedules, including 4×10 hour days Company Culture:
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer committed to diversity and inclusion, emphasizing performance, courage, resilience, and precision. Application:
The application window closes in 90 days. Applicants are encouraged to apply within 5–30 days for optimal consideration.
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Lockheed Martin is seeking an experienced
ElectroMechanical Packaging Design Engineer
to join their team in Dallas, Texas. This is a full-time, first shift position with potential for relocation. Job Description:
This role involves hardware development of military electronics within flight-worthy assemblies. The engineer will collaborate with cross-functional teams to complete hardware designs and support integration efforts for the designated electronic system. Key Responsibilities:
Design and develop hardware for military electronics, including processors, interface electronics, power cards, and flexes. Work within physical and thermal constraints, requiring experience with high-density electronic packaging. Create and demonstrate reference designs to support multiple contract wins within the RF Center of Excellence. Collaborate with cross-functional teams for seamless hardware integration. Qualifications:
Basic Qualifications:
Secret Clearance Design experience with PWBs / CCAs and harnesses Proficiency with Pro-E/Creo, Windchill, and LM design processes Bachelor’s degree in an engineering or related field Experience in Electronic Packaging and Military Defense design Desired Skills:
Experience as a Packaging Lead Knowledge of CREO Experience with PWBs, CCAs, and Harnesses RF packaging Design Experience AutoCAD experience Zuken E3 Experience Additional Information:
US Citizenship is mandatory due to security clearance requirements Part-time remote telework available; details discussed during hiring Flexible work schedules, including 4×10 hour days Company Culture:
Lockheed Martin is an Equal Opportunity/Affirmative Action Employer committed to diversity and inclusion, emphasizing performance, courage, resilience, and precision. Application:
The application window closes in 90 days. Applicants are encouraged to apply within 5–30 days for optimal consideration.
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