Lockheed Martin
ElectroMechanical Packaging Engineer III
Join us at Lockheed Martin as an Electronics Packaging Engineer within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and an electronics and mechanical CAD (drawing development and release). Location: This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in Littleton or Englewood, CO and be expected to work a flexible 9x80 schedule in the office full-time. Responsibilities
Work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. Key Activities You Will Accomplish In This Role
Identify initial physical architecture for the Avionics subsystem. Conduct R&D trade studies for Pre-SRR design phase. Define the requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end of year reports. Work on a cross-functional team in the development and integration of avionics systems. Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis. Participate in iterative design reviews, Engineering Material Review Board hardware discrepancy decisions and Failure Review Board as required. Resolve test anomalies and support system level testing. To Be Effective In This Role, You Will Need
Experience with full product life cycle - knowledge of the definition, interpretation, and implementation of design requirements, coordination and execution of hardware designs, development and integration of hardware for both custom and procured electronic assemblies in accordance with all Lockheed Martin Space engineering process specifications. Attend Design Reviews and provide technical feedback. 3+ years professional experience. Qualified candidate must hold an active DoD Final Secret Security Clearance; US Citizenship is required. Seniority level
Mid-Senior level Employment type
Full-time Job function
Engineering and Information Technology Industries
Defense and Space Manufacturing
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Join us at Lockheed Martin as an Electronics Packaging Engineer within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and an electronics and mechanical CAD (drawing development and release). Location: This position does not support teleworking; the selected candidate will be located near our Lockheed Martin Space facility in Littleton or Englewood, CO and be expected to work a flexible 9x80 schedule in the office full-time. Responsibilities
Work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations. Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. Key Activities You Will Accomplish In This Role
Identify initial physical architecture for the Avionics subsystem. Conduct R&D trade studies for Pre-SRR design phase. Define the requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle. Generate and release design disclosure artifacts including technical presentations and end of year reports. Work on a cross-functional team in the development and integration of avionics systems. Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis. Participate in iterative design reviews, Engineering Material Review Board hardware discrepancy decisions and Failure Review Board as required. Resolve test anomalies and support system level testing. To Be Effective In This Role, You Will Need
Experience with full product life cycle - knowledge of the definition, interpretation, and implementation of design requirements, coordination and execution of hardware designs, development and integration of hardware for both custom and procured electronic assemblies in accordance with all Lockheed Martin Space engineering process specifications. Attend Design Reviews and provide technical feedback. 3+ years professional experience. Qualified candidate must hold an active DoD Final Secret Security Clearance; US Citizenship is required. Seniority level
Mid-Senior level Employment type
Full-time Job function
Engineering and Information Technology Industries
Defense and Space Manufacturing
#J-18808-Ljbffr