Lockheed Martin
Electronics Packaging Analyst III
Lockheed Martin, Salt Lake City, Utah, United States, 84193
Description
Join us at Lockheed Martin as an
Electronics Packaging Engineer
within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and electronics and mechanical CAD (drawing development and release). This teleworking position allows you to work remotely.
What does this role look like? Responsibilities include:
Perform preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft and missiles flight electronic components and boxes using standardized processes and tools.
Work in a multi‑disciplined team environment to help with design trades and detailed design/analysis activity.
Understand applicable mechanical (thermal, materials, etc.) and system level requirements/parameters.
Support development of reliable, compliant flightworthy components and structural assemblies that satisfy contractual design criteria and producibility requirements defined by Manufacturing and Quality.
Provide test input/instrumentation data to environmental test personnel and collaborate with lead engineering personnel to interpret and correlate test results.
Minimum 5+ years professional experience.
Basic Qualifications
Bachelor of Science or higher in Mechanical Engineering or related discipline, or equivalent experience/combined education.
Understand basics of electronics packaging analysis and willingness to learn newer advanced analytical techniques.
Knowledge of spacecraft or missiles analysis methods for electronic components, including hand calculations.
Experience with finite element modeling for random vibration and thermal analysis.
Desired Skills
Collaborative and highly integrated team environment.
Thermal and structural fatigue analysis of electronic components and attachments.
Experience with NASTRAN, NX Advanced Simulation, Abaqus, MATLAB, Mathcad and CREO.
Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware.
Familiarity with different electronic package types and mounting methods.
Good communication, oral and written, social and presentation skills.
Proficient in Microsoft Office, especially Excel.
Clearance Level None
Other Important Information You Should Know Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match.
Ability to Work Remotely This full‑time remote telework position requires you to work remotely full time at a location other than a Lockheed Martin designated office or job site. Employees may travel to a Lockheed Martin office for periodic meetings.
Work Schedules Lockheed Martin supports a variety of alternate work schedules. Schedule for this position: 9x80 every other Friday off.
Pay Rate and Benefits Pay rate: The annual base salary range for this position in major metropolitan areas in California and New York is $102,800 – $178,135. For other states the salary range reflects the candidate’s final work location. The salary information is a general guideline only. Lockheed Martin considers factors such as scope and responsibilities, candidate’s work experience, education, key skills, and market and business considerations when extending an offer.
Benefits offered: Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, Employee Assistance Program, Education Assistance, Parental Leave, Paid time off, and Holidays. This position is incentive plan eligible.
Equal Opportunity Employer Statement Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
Application Window The application window will close in 90 days; applicants are encouraged to apply within 5–30 days of the requisition posting date to receive optimal consideration.
Join Us As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Our employees play an active role in strengthening the quality of life where we live and work by volunteering more than 850,000 hours annually.
#J-18808-Ljbffr
Electronics Packaging Engineer
within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, and electronics and mechanical CAD (drawing development and release). This teleworking position allows you to work remotely.
What does this role look like? Responsibilities include:
Perform preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft and missiles flight electronic components and boxes using standardized processes and tools.
Work in a multi‑disciplined team environment to help with design trades and detailed design/analysis activity.
Understand applicable mechanical (thermal, materials, etc.) and system level requirements/parameters.
Support development of reliable, compliant flightworthy components and structural assemblies that satisfy contractual design criteria and producibility requirements defined by Manufacturing and Quality.
Provide test input/instrumentation data to environmental test personnel and collaborate with lead engineering personnel to interpret and correlate test results.
Minimum 5+ years professional experience.
Basic Qualifications
Bachelor of Science or higher in Mechanical Engineering or related discipline, or equivalent experience/combined education.
Understand basics of electronics packaging analysis and willingness to learn newer advanced analytical techniques.
Knowledge of spacecraft or missiles analysis methods for electronic components, including hand calculations.
Experience with finite element modeling for random vibration and thermal analysis.
Desired Skills
Collaborative and highly integrated team environment.
Thermal and structural fatigue analysis of electronic components and attachments.
Experience with NASTRAN, NX Advanced Simulation, Abaqus, MATLAB, Mathcad and CREO.
Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware.
Familiarity with different electronic package types and mounting methods.
Good communication, oral and written, social and presentation skills.
Proficient in Microsoft Office, especially Excel.
Clearance Level None
Other Important Information You Should Know Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match.
Ability to Work Remotely This full‑time remote telework position requires you to work remotely full time at a location other than a Lockheed Martin designated office or job site. Employees may travel to a Lockheed Martin office for periodic meetings.
Work Schedules Lockheed Martin supports a variety of alternate work schedules. Schedule for this position: 9x80 every other Friday off.
Pay Rate and Benefits Pay rate: The annual base salary range for this position in major metropolitan areas in California and New York is $102,800 – $178,135. For other states the salary range reflects the candidate’s final work location. The salary information is a general guideline only. Lockheed Martin considers factors such as scope and responsibilities, candidate’s work experience, education, key skills, and market and business considerations when extending an offer.
Benefits offered: Medical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, Employee Assistance Program, Education Assistance, Parental Leave, Paid time off, and Holidays. This position is incentive plan eligible.
Equal Opportunity Employer Statement Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.
Application Window The application window will close in 90 days; applicants are encouraged to apply within 5–30 days of the requisition posting date to receive optimal consideration.
Join Us As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Our employees play an active role in strengthening the quality of life where we live and work by volunteering more than 850,000 hours annually.
#J-18808-Ljbffr