Nokia
Manufacturing Engineer – PIC wafer fabrication
Nokia, Sunnyvale, California, United States, 94087
Manufacturing Engineer – PIC wafer fabrication
Join to apply for the
Manufacturing Engineer – PIC wafer fabrication
role at
Nokia . Job Description In an increasingly connected world, the pandemic has highlighted how essential telecom networks are to society. The
Network Infrastructure
group is at the forefront of a revolution in connectivity, delivering faster and more extensive network capacity globally through innovation and expertise. Join
Optical Networks division , where scale meets innovation in the AI-driven data center era. Following the acquisition of Infinera, Nokia has unified industry leaders to redefine connectivity's future. When you apply, your information will be used solely for recruitment within the group. Responsibilities include: Optimizing plasma deposition, plasma etch, wet etch, clean processes, and related fabrication steps for PIC wafers. Scaling PIC wafer fabrication processes to larger wafer sizes while maintaining yield, uniformity, and performance standards. Troubleshooting process issues to ensure smooth production flow and supporting engineering teams in resolving equipment or process problems. Executing fabrication tasks and data collection to support process development for etch, deposition, and photolithography activities for future PIC technologies. Using metrology tools and test structures to control processes, improve yields, and facilitate new process development. Required Skills and Experience: Knowledge of semiconductor fabrication processes, including etch, deposition, photolithography, with application of JMP, DOE, SPC. Strong communication, leadership, and initiative skills. Experience supporting a 24/7 fab environment, including procedure writing, root cause analysis, and problem resolution. Qualifications:
B.S. degree or equivalent experience. Preferred Skills: Extensive experience (5+ years) in semiconductor wafer fabrication, especially in etch, deposition, photolithography. Familiarity with wafer metrology tools such as ellipsometry, CD-SEM, and overlay measurements. Clear communication and proactive problem-solving skills. Experience from process development to mature production, including pathfinding and ramp-up. Background in compound semiconductors is a plus. About Us Nokia is committed to innovation in mobile, fixed, and cloud networks. We foster an inclusive culture that values new ideas, risk-taking, and authenticity. We offer continuous learning, well-being programs, diverse teams, and mentoring to support your growth. Nokia is an equal opportunity employer, recognized for its commitment to inclusion and ethics. Join us to create technology that unites the world.
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Join to apply for the
Manufacturing Engineer – PIC wafer fabrication
role at
Nokia . Job Description In an increasingly connected world, the pandemic has highlighted how essential telecom networks are to society. The
Network Infrastructure
group is at the forefront of a revolution in connectivity, delivering faster and more extensive network capacity globally through innovation and expertise. Join
Optical Networks division , where scale meets innovation in the AI-driven data center era. Following the acquisition of Infinera, Nokia has unified industry leaders to redefine connectivity's future. When you apply, your information will be used solely for recruitment within the group. Responsibilities include: Optimizing plasma deposition, plasma etch, wet etch, clean processes, and related fabrication steps for PIC wafers. Scaling PIC wafer fabrication processes to larger wafer sizes while maintaining yield, uniformity, and performance standards. Troubleshooting process issues to ensure smooth production flow and supporting engineering teams in resolving equipment or process problems. Executing fabrication tasks and data collection to support process development for etch, deposition, and photolithography activities for future PIC technologies. Using metrology tools and test structures to control processes, improve yields, and facilitate new process development. Required Skills and Experience: Knowledge of semiconductor fabrication processes, including etch, deposition, photolithography, with application of JMP, DOE, SPC. Strong communication, leadership, and initiative skills. Experience supporting a 24/7 fab environment, including procedure writing, root cause analysis, and problem resolution. Qualifications:
B.S. degree or equivalent experience. Preferred Skills: Extensive experience (5+ years) in semiconductor wafer fabrication, especially in etch, deposition, photolithography. Familiarity with wafer metrology tools such as ellipsometry, CD-SEM, and overlay measurements. Clear communication and proactive problem-solving skills. Experience from process development to mature production, including pathfinding and ramp-up. Background in compound semiconductors is a plus. About Us Nokia is committed to innovation in mobile, fixed, and cloud networks. We foster an inclusive culture that values new ideas, risk-taking, and authenticity. We offer continuous learning, well-being programs, diverse teams, and mentoring to support your growth. Nokia is an equal opportunity employer, recognized for its commitment to inclusion and ethics. Join us to create technology that unites the world.
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