Infinera
Senior Hardware Manager
Join Nokia's Hardware team and be responsible for developing and designing high-speed boards. You'll manage and lead Electrical and Mechanical/thermal engineers to deliver complex high-speed telecom products. Your projects will include developing new products, researching new technologies, sustaining engineering on existing products, and engineering related to other company project activities. Major Responsibilities Manage the daily activities of a team of talented Board designers, mechanical, and thermal engineers. Design, test, validate, and release Chassis and Printed Circuit Boards (PCBs) containing digital and mixed-signal circuits for deployment into the telecommunications market. Duties may also include existing product engineering support and documentation. As a hands-on Hardware leader, provide guidance to board designers designing high-speed boards. You'll be responsible for PCBA design, including schematics capture, layout, and full EDVT. As a hands-on Thermal and Mechanical engineering leader, you'll design high-speed line cards and telecom Chassis. Work from product concept to production with minimal supervision. Contribute to the definition of product features considering mechanical, electrical, thermal tradeoffs, customer needs, and company goals. Have a good understanding of thermal solutions, including complex heatsink design, 2D/3D vapor chambers, TPCM materials, etc. Follow through and energetically support the introduction of new designs to production. Drive designs from conception through manufacturing production, including architecture requirements, functional specifications, design, prototypes, hardware bring-up, and verification. Work with cross-functional teams (SW, FW, SDVT, Diag, MFG, Optical, Architecture). Support the product through pre- and post-production releases. Work with ODM vendors to review design schematics and EDVT reports and provide guidance as needed. Experience Required BSME or MSME preferred with over 10 years of experience as a technical leader managing a hardware team. Responsibilities include hiring, coaching, and setting development goals for the team. Experience with ARM-based processors, FPGAs, high-speed Ethernet Serdes, and power supplies is essential. Experience with tolerance analyses, shock and vibration testing, and fiber management is also required. A good understanding of Ethernet (CAUI4, 200GAUI-4, 400GAUI-8, FlexE, 800G) and OTN (OTU4) Standards is a plus. Experience with high-speed SerDes and applicable layout constraints (26G, 56G) is desirable. Knowledge of PCB fabrication, fab & assembly design rules, Via Back drilling, PCB sequential lamination process, and product integration with mechanical components is required. Experience in thermal design of high-powered, densely packed circuit packs is necessary, and the ability to provide cooling solutions for high-power ASICs is essential. Good knowledge of tools such as Cadence, CREO, and FloTherm is required. Familiarity with NEBS, ETSI, ANSI, and acoustic requirements is beneficial. Fluent in written and verbal English is required. The ability to work independently and across multiple time zones is considered a plus.
Join Nokia's Hardware team and be responsible for developing and designing high-speed boards. You'll manage and lead Electrical and Mechanical/thermal engineers to deliver complex high-speed telecom products. Your projects will include developing new products, researching new technologies, sustaining engineering on existing products, and engineering related to other company project activities. Major Responsibilities Manage the daily activities of a team of talented Board designers, mechanical, and thermal engineers. Design, test, validate, and release Chassis and Printed Circuit Boards (PCBs) containing digital and mixed-signal circuits for deployment into the telecommunications market. Duties may also include existing product engineering support and documentation. As a hands-on Hardware leader, provide guidance to board designers designing high-speed boards. You'll be responsible for PCBA design, including schematics capture, layout, and full EDVT. As a hands-on Thermal and Mechanical engineering leader, you'll design high-speed line cards and telecom Chassis. Work from product concept to production with minimal supervision. Contribute to the definition of product features considering mechanical, electrical, thermal tradeoffs, customer needs, and company goals. Have a good understanding of thermal solutions, including complex heatsink design, 2D/3D vapor chambers, TPCM materials, etc. Follow through and energetically support the introduction of new designs to production. Drive designs from conception through manufacturing production, including architecture requirements, functional specifications, design, prototypes, hardware bring-up, and verification. Work with cross-functional teams (SW, FW, SDVT, Diag, MFG, Optical, Architecture). Support the product through pre- and post-production releases. Work with ODM vendors to review design schematics and EDVT reports and provide guidance as needed. Experience Required BSME or MSME preferred with over 10 years of experience as a technical leader managing a hardware team. Responsibilities include hiring, coaching, and setting development goals for the team. Experience with ARM-based processors, FPGAs, high-speed Ethernet Serdes, and power supplies is essential. Experience with tolerance analyses, shock and vibration testing, and fiber management is also required. A good understanding of Ethernet (CAUI4, 200GAUI-4, 400GAUI-8, FlexE, 800G) and OTN (OTU4) Standards is a plus. Experience with high-speed SerDes and applicable layout constraints (26G, 56G) is desirable. Knowledge of PCB fabrication, fab & assembly design rules, Via Back drilling, PCB sequential lamination process, and product integration with mechanical components is required. Experience in thermal design of high-powered, densely packed circuit packs is necessary, and the ability to provide cooling solutions for high-power ASICs is essential. Good knowledge of tools such as Cadence, CREO, and FloTherm is required. Familiarity with NEBS, ETSI, ANSI, and acoustic requirements is beneficial. Fluent in written and verbal English is required. The ability to work independently and across multiple time zones is considered a plus.