Approach Venture
Senior Process Development Engineer
Approach Venture, Los Angeles, California, United States, 90079
Job Description
All potential applicants are encouraged to scroll through and read the complete job description before applying. Senior Process Engineer - Help Pioneer the Future of Optical Computing Hardware! Location:
Gardena, CA (Onsite) Opportunity Summary: A well-funded stealth startup is developing breakthrough optical computing hardware designed to surpass the limitations of traditional electronics. Backed by experienced founders and early-stage investors, the team combines advanced photonics, packaging, and manufacturing. We are seeking a Senior Process Engineer to lead key development efforts in wafer and die-level packaging. This hands-on, highly technical role is central to launching our first product. About Us: We are a group of engineers, scientists, and builders focused on optical computing innovation. Our startup combines experience from frontier tech ventures with a mission to redefine how light is used in computational systems. With early funding secured, we are building hardware and manufacturing capabilities to develop vertically integrated systems that blend photonics, electronics, and manufacturing into a next-generation computing platform. Job Duties: Develop and own process recipes for wafer-level and die-level packaging techniques, including eutectic bonding, flip-chip attachment, underfill, and protective coatings. Achieve high-yield bonding (>99.9%) and ensure thermal reliability through 20,000+ cycles. Analyze failure mechanisms using X-ray, SAM, SEM/TEM, shear testing, and other methods; incorporate findings into process and design improvements. Lead the transition of R&D processes into repeatable, high-volume production workflows using SPC and tool selection methodologies. Serve as technical lead for corrective actions stemming from root cause analysis and field data. Collaborate with design, electrical, and mechanical engineering teams to optimize packaging architecture. Support hiring efforts and mentor junior engineers to grow internal manufacturing capabilities. Qualifications: MS or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or related field. 3+ years of hands-on experience in semiconductor process development or advanced packaging. Proven track record developing and qualifying bonding processes such as eutectic, flip-chip, or hybrid methods. Strong command of statistical quality control practices and continuous improvement strategies. Ability to work in a fast-paced lab and production environment, including extended hours when needed. Preferred Experience: Background in nanofabrication techniques (e-beam lithography, dry etch, PECVD, CMP). Experience integrating photonic components such as SiPh or InP into electronic packages. Prior work with optoelectronic device packaging or hybrid integration. Security Clearance: Must be able to obtain US Secret clearance. Why Join Us: High-impact opportunity at the forefront of photonics and next-gen computing. Seed-funded startup with ambitious growth plans and technical leadership roles. Early-stage equity and long-term incentives. Flexible work culture and support for innovation. Relocation assistance to Southern California. Comprehensive health coverage: medical, dental, and vision. Paid parental leave, flexible vacation policy, and holidays. Compensation:
$120,000 - $200,000 plus equity.
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All potential applicants are encouraged to scroll through and read the complete job description before applying. Senior Process Engineer - Help Pioneer the Future of Optical Computing Hardware! Location:
Gardena, CA (Onsite) Opportunity Summary: A well-funded stealth startup is developing breakthrough optical computing hardware designed to surpass the limitations of traditional electronics. Backed by experienced founders and early-stage investors, the team combines advanced photonics, packaging, and manufacturing. We are seeking a Senior Process Engineer to lead key development efforts in wafer and die-level packaging. This hands-on, highly technical role is central to launching our first product. About Us: We are a group of engineers, scientists, and builders focused on optical computing innovation. Our startup combines experience from frontier tech ventures with a mission to redefine how light is used in computational systems. With early funding secured, we are building hardware and manufacturing capabilities to develop vertically integrated systems that blend photonics, electronics, and manufacturing into a next-generation computing platform. Job Duties: Develop and own process recipes for wafer-level and die-level packaging techniques, including eutectic bonding, flip-chip attachment, underfill, and protective coatings. Achieve high-yield bonding (>99.9%) and ensure thermal reliability through 20,000+ cycles. Analyze failure mechanisms using X-ray, SAM, SEM/TEM, shear testing, and other methods; incorporate findings into process and design improvements. Lead the transition of R&D processes into repeatable, high-volume production workflows using SPC and tool selection methodologies. Serve as technical lead for corrective actions stemming from root cause analysis and field data. Collaborate with design, electrical, and mechanical engineering teams to optimize packaging architecture. Support hiring efforts and mentor junior engineers to grow internal manufacturing capabilities. Qualifications: MS or PhD in Materials Science, Electrical Engineering, Chemical Engineering, or related field. 3+ years of hands-on experience in semiconductor process development or advanced packaging. Proven track record developing and qualifying bonding processes such as eutectic, flip-chip, or hybrid methods. Strong command of statistical quality control practices and continuous improvement strategies. Ability to work in a fast-paced lab and production environment, including extended hours when needed. Preferred Experience: Background in nanofabrication techniques (e-beam lithography, dry etch, PECVD, CMP). Experience integrating photonic components such as SiPh or InP into electronic packages. Prior work with optoelectronic device packaging or hybrid integration. Security Clearance: Must be able to obtain US Secret clearance. Why Join Us: High-impact opportunity at the forefront of photonics and next-gen computing. Seed-funded startup with ambitious growth plans and technical leadership roles. Early-stage equity and long-term incentives. Flexible work culture and support for innovation. Relocation assistance to Southern California. Comprehensive health coverage: medical, dental, and vision. Paid parental leave, flexible vacation policy, and holidays. Compensation:
$120,000 - $200,000 plus equity.
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