Celestial AI
Package Integration Engineer
Celestial AI Systems and Packaging group is hiring a Package Integration Engineer to oversee packaging integration and vendor coordination from design to manufacturing. They will define day-to-day priorities, guide build plans, drive yield improvement, and ensure smooth project execution. Essential Duties and Responsibilities: Work with cross-functional teams to coordinate package integration, design, manufacturing and reliability efforts of test vehicles and product builds Work with OSAT (Outsourced Semiconductor Assembly and Test) and other third party vendors to bring product from concept to NPI (New Product Introduction) and HVM (High-Volume Manufacturing) Align day-to-day activities of individual contributors and managers and track progress in project and document management software Use DOE (Design of Experiment) principles and engineering judgement to propose and manage material build plans to support process development, material selection, bringup, test, and reliability efforts Analyze manufacturing data (inline monitors, test, third party updates) to provide source-of-truth reports on yield, failure modes and development progress Participate in and support path-finding activities in package assembly and test Qualifications: MS in physical sciences/engineering and 10+ years of relevant industry experience Exposure to full product life cycle (end to end) Experience in working with third party foundries and/or OSATs Preferred Qualifications: Advanced degree in science or engineering fields Understanding of cross-functional packaging areas (floor plan, layout and architecture, process, thermal, mechanical, SI/PI, testing, and FA) Demonstrated technical judgement in context of assemblies of various form factors, thermo-mechanical, reliability, and cost constraints Familiarity with optical packaging Familiarity with systems engineering procedures Previous experience with Atlassian Jira/Confluence systems Previous experience with data analysis in JMP/Py/R Excellent problem solving and communication skills Location: Santa Clara, CA For California Location: As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $185,000.00 - $215,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews. We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing. Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.
Celestial AI Systems and Packaging group is hiring a Package Integration Engineer to oversee packaging integration and vendor coordination from design to manufacturing. They will define day-to-day priorities, guide build plans, drive yield improvement, and ensure smooth project execution. Essential Duties and Responsibilities: Work with cross-functional teams to coordinate package integration, design, manufacturing and reliability efforts of test vehicles and product builds Work with OSAT (Outsourced Semiconductor Assembly and Test) and other third party vendors to bring product from concept to NPI (New Product Introduction) and HVM (High-Volume Manufacturing) Align day-to-day activities of individual contributors and managers and track progress in project and document management software Use DOE (Design of Experiment) principles and engineering judgement to propose and manage material build plans to support process development, material selection, bringup, test, and reliability efforts Analyze manufacturing data (inline monitors, test, third party updates) to provide source-of-truth reports on yield, failure modes and development progress Participate in and support path-finding activities in package assembly and test Qualifications: MS in physical sciences/engineering and 10+ years of relevant industry experience Exposure to full product life cycle (end to end) Experience in working with third party foundries and/or OSATs Preferred Qualifications: Advanced degree in science or engineering fields Understanding of cross-functional packaging areas (floor plan, layout and architecture, process, thermal, mechanical, SI/PI, testing, and FA) Demonstrated technical judgement in context of assemblies of various form factors, thermo-mechanical, reliability, and cost constraints Familiarity with optical packaging Familiarity with systems engineering procedures Previous experience with Atlassian Jira/Confluence systems Previous experience with data analysis in JMP/Py/R Excellent problem solving and communication skills Location: Santa Clara, CA For California Location: As an early stage start up, we offer an extremely attractive total compensation package inclusive of competitive base salary, bonus and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $185,000.00 - $215,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews. We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing. Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.