Advanced Technology Search
Advanced Package Technology Engineer
Advanced Technology Search, Fort Collins, Colorado, us, 80523
Job Description:
As part of the WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers. They will be responsible for developing cost-effective, high-performance, advanced custom package solutions that achieve signal integrity, thermal, and structural reliability, while adhering to substrate fabrication and package assembly design rules and project schedules. 2.5D & 3D are cutting-edge package technologies that push the boundaries of current technology. Job Scope (Advanced Package Technology Engineer):
Provide expertise in 2.5D / 3D technology; engage with current and future customers on technology needs and updates; consolidate requirements; and drive towards unified solutions. Lead in identification, development, and qualification; manage programs with external assembly partners. Engage with memory suppliers to define technology and quality requirements. Coordinate with other technical teams (DI, Pkg Design, Test Dev) as part of a Cross Functional Team. Support new design wins, NPI, and volume ramps. Develop alternative sourcing and qualification strategies. Basic Qualifications:
Master’s Degree in Mechanical, Electrical, or Electronics Engineering with 6+ years of relevant experience in developing cost-effective, high-performance packaging solutions, including single & multi-chip, large, complex, custom & fine pitch flip chip packaging with advanced substrates & interposers. Or PhD with 10+ years of relevant experience. Specific Requirements:
4 to 6 years of hands-on experience in 2.5D / 3D development. Deep knowledge of advanced silicon fabrication, bumping, interposers, substrates, assembly processes, materials, supplier selection, BOM definition, and thermal/mechanical interactions. Additional Skills and Knowledge:
Strong understanding of emerging silicon, package, and substrate technologies, bumping and assembly processes, design rules, failure analysis tools, materials, equipment, industry standards, regulations, and quality systems. Excellent teamwork, project management, analytical, problem-solving, and interpersonal skills. Self-driven, flexible, agile, result-oriented, capable of developing concepts into structured projects, and generating innovative solutions. Hands-on experience with modeling (thermal & mechanical) and CAD tools (APD, AutoCAD, SolidWorks) for design optimization. Knowledge of advanced node silicon fabrication, PCB technologies, and board assembly processes. Effective communication skills for collaboration with global teams and clients, with willingness to travel as needed.
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As part of the WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers. They will be responsible for developing cost-effective, high-performance, advanced custom package solutions that achieve signal integrity, thermal, and structural reliability, while adhering to substrate fabrication and package assembly design rules and project schedules. 2.5D & 3D are cutting-edge package technologies that push the boundaries of current technology. Job Scope (Advanced Package Technology Engineer):
Provide expertise in 2.5D / 3D technology; engage with current and future customers on technology needs and updates; consolidate requirements; and drive towards unified solutions. Lead in identification, development, and qualification; manage programs with external assembly partners. Engage with memory suppliers to define technology and quality requirements. Coordinate with other technical teams (DI, Pkg Design, Test Dev) as part of a Cross Functional Team. Support new design wins, NPI, and volume ramps. Develop alternative sourcing and qualification strategies. Basic Qualifications:
Master’s Degree in Mechanical, Electrical, or Electronics Engineering with 6+ years of relevant experience in developing cost-effective, high-performance packaging solutions, including single & multi-chip, large, complex, custom & fine pitch flip chip packaging with advanced substrates & interposers. Or PhD with 10+ years of relevant experience. Specific Requirements:
4 to 6 years of hands-on experience in 2.5D / 3D development. Deep knowledge of advanced silicon fabrication, bumping, interposers, substrates, assembly processes, materials, supplier selection, BOM definition, and thermal/mechanical interactions. Additional Skills and Knowledge:
Strong understanding of emerging silicon, package, and substrate technologies, bumping and assembly processes, design rules, failure analysis tools, materials, equipment, industry standards, regulations, and quality systems. Excellent teamwork, project management, analytical, problem-solving, and interpersonal skills. Self-driven, flexible, agile, result-oriented, capable of developing concepts into structured projects, and generating innovative solutions. Hands-on experience with modeling (thermal & mechanical) and CAD tools (APD, AutoCAD, SolidWorks) for design optimization. Knowledge of advanced node silicon fabrication, PCB technologies, and board assembly processes. Effective communication skills for collaboration with global teams and clients, with willingness to travel as needed.
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