X-FAB
The Product Development Engineer is responsible for defining new module exploration and development, new technology exploration and development, all new SiC process requirements, and the formal release of all new SiC process and module offerings, within X-Fab Texas. Duties include working directly with SiC customers and the functional departments within the X-FAB Texas organization to assure standards of excellence are established and maintained, as well as ensure that the systematic and infrastructural components to new technological developments are in place.
Additionally, the Product Development Engineer must continue to support Process Integration as both new processes that are integrated into XFAB as well as technical issues concerning continual improvement. With the combined knowledge of device physics, device design, and material processing, the Product Development Engineer maintains a unique perspective to aid in scrap reduction, yield improvement, and overall identification and implementation of best practices of semiconductor processing techniques.
Responsibilities:
Maintain X-FAB’s standing as the leader in SiC foundry services. Ensure timely and barrier-free transition for customer access to new module and technology offerings. Maximize profit potential for high-margin services/offerings. Collaborate with all major X-Fab internal customers (Mask Tooling, IT, Process Engineering, Process Integration, Yield Enhancement, etc.). Provide technical direction for the requirements, design, characterization, and integration of X-Fab’s SiC module and technology offering. Establish with functional departments a system for module/technology onboarding and streamlined implementation. Write proposals for new module and technology development and associated equipment needs to outline costs and projected ROI. Own the development lifecycle and manage technical risks. Consistently deliver high-quality services to our internal and external customers. Utilize inputs from customers and technical conferences to continually refine X-FAB’s SiC Module and Technology roadmap to stay as the benchmark of the industry. Identify opportunities for X-FAB IP development. Ensure manufacturability of SiC Processes and Process Block flows for both modules and new technologies. Work with the Process Engineering Team and our customers to ensure: All new processes and applications where manufacturability is a potential issue are identified. Our processes are manufacturable prior to release. Maintain in-depth technical knowledge of the SiC discrete process and business goals as well as other technological areas not typically/currently associated with SiC in the industry such as CMOS. Possess strong device physics understanding for Si as well as WBG materials. Have a high level of knowledge concerning WBG material processing. Understand both material and electrical characterization methods and data preparation and analysis. Understand PCM design and test routines. Create and publish design rules and aid in DRC creation. Be proficient in design architectures for various technology types as well as the layout tools required to implement designs. Demonstrate strong written and verbal communication skills. Exhibit excellent interpersonal skills. Be goal-oriented and deadline-driven, with the ability to identify and solve problems as they arise. Have strong budgeting and scheduling skills. Be proficient in word processing, spreadsheet programs, statistical analysis tools, and PowerPoint. Job requirements
M.S. / Doctor of Philosophy in Electrical Engineering, Physics, Material Science or related field. 5 years experience in the field of semiconductor development. Graduate school may count as equivalent years experience depending on the applicant’s area of emphasis.
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Maintain X-FAB’s standing as the leader in SiC foundry services. Ensure timely and barrier-free transition for customer access to new module and technology offerings. Maximize profit potential for high-margin services/offerings. Collaborate with all major X-Fab internal customers (Mask Tooling, IT, Process Engineering, Process Integration, Yield Enhancement, etc.). Provide technical direction for the requirements, design, characterization, and integration of X-Fab’s SiC module and technology offering. Establish with functional departments a system for module/technology onboarding and streamlined implementation. Write proposals for new module and technology development and associated equipment needs to outline costs and projected ROI. Own the development lifecycle and manage technical risks. Consistently deliver high-quality services to our internal and external customers. Utilize inputs from customers and technical conferences to continually refine X-FAB’s SiC Module and Technology roadmap to stay as the benchmark of the industry. Identify opportunities for X-FAB IP development. Ensure manufacturability of SiC Processes and Process Block flows for both modules and new technologies. Work with the Process Engineering Team and our customers to ensure: All new processes and applications where manufacturability is a potential issue are identified. Our processes are manufacturable prior to release. Maintain in-depth technical knowledge of the SiC discrete process and business goals as well as other technological areas not typically/currently associated with SiC in the industry such as CMOS. Possess strong device physics understanding for Si as well as WBG materials. Have a high level of knowledge concerning WBG material processing. Understand both material and electrical characterization methods and data preparation and analysis. Understand PCM design and test routines. Create and publish design rules and aid in DRC creation. Be proficient in design architectures for various technology types as well as the layout tools required to implement designs. Demonstrate strong written and verbal communication skills. Exhibit excellent interpersonal skills. Be goal-oriented and deadline-driven, with the ability to identify and solve problems as they arise. Have strong budgeting and scheduling skills. Be proficient in word processing, spreadsheet programs, statistical analysis tools, and PowerPoint. Job requirements
M.S. / Doctor of Philosophy in Electrical Engineering, Physics, Material Science or related field. 5 years experience in the field of semiconductor development. Graduate school may count as equivalent years experience depending on the applicant’s area of emphasis.
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