Atomic Semi
Process Development Engineer - Back End of Line
Atomic Semi, San Francisco, California, United States, 94199
About Atomic Semi
Qualifications, skills, and all relevant experience needed for this role can be found in the full description below. Atomic Semi is building a small, fast semiconductor fab. It’s already possible to build this with today’s technology and a few simplifications. We’ll build the tools ourselves so we can quickly iterate and improve. We’re building a small team of exceptional, hands-on engineers to make this happen. Mechanical, electrical, hardware, computer, and process. We’ll own the stack from atoms to architecture. Our team is optimistic about the future and we want to continue pushing the limits of technology. Smaller is better. Faster is better. Building it ourselves is better. We believe our team and lab can build anything. We’ve set up 3D printers, a wide array of microscopes, e-beam writers, general fabrication equipment - and whatever is missing, we’ll just invent along the way. Atomic was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the role As a Process Development Engineer at Atomic Semi, you'll bridge the critical interface between BEOL processing and advanced packaging, developing novel integration schemes for next-generation semiconductor devices. We're looking for someone with hands-on experience in interconnect metallization, dielectric processes, or chip-to-package connections, combined with an eagerness to push beyond conventional approaches. You'll need to digest complex technical literature while translating nanofabrication fundamentals into practical process solutions. This is a high-ownership role with lots of autonomy in a fast-moving startup environment. You’ll have the opportunity to contribute to novel R&D processes and influence tool design. Candidates should have hands-on cleanroom experience and a track record of developing nanofabrication recipes from scratch, ideally across multiple process steps. Responsibilities Develop and optimize bond pad structures (e.g., UBM, RDL pads, and other interconnect schemes) for advanced packaging applications
Characterize material interfaces using SEM, EDX, and electrical testing to ensure reliable chip-to-package connections
Generate process specifications and transfer recipes from R&D to production
Collaborate with packaging team to troubleshoot issues related to BEOL structures
Analyze failure modes at the BEOL-package interface and implement corrective actions
Required Experience PhD in Materials Science, Chemical Engineering, Electrical Engineering, or related field (or MS with 2+ years relevant experience)
Hands-on experience with at least one BEOL process: interconnect metallization, dielectric deposition, UBM, or bond pad fabrication
Understanding of chip attach processes and their interaction with BEOL structures
Experience with material characterization techniques (SEM, cross-sectioning, electrical testing)
Nice-to-have Experience with flip-chip, WLCSP, or advanced packaging technologies
Working at Atomic Semi We’re an early-stage hardware startup with solid funding, world-class advisors, and a lab/office in San Francisco, CA. Compensation:
Atomic Semi is committed to fair and equitable compensation practices. The annual salary range for this role is $117,000 – $188,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in Atomic Semi. Benefits:
Atomic Semi offers the following benefits, subject to applicable eligibility requirements: Medical, Dental, and Vision insurance
Generous Paid Time Off inclusive of Holidays and Sick Time
Visa Sponsorship
Life and Disability Insurance
Paid Parental Leave
401(k) retirement plan
Weekly Learning & Development opportunities
Commuter Benefits including Parking and Late Night Uber rides from the office
Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses. Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.
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Qualifications, skills, and all relevant experience needed for this role can be found in the full description below. Atomic Semi is building a small, fast semiconductor fab. It’s already possible to build this with today’s technology and a few simplifications. We’ll build the tools ourselves so we can quickly iterate and improve. We’re building a small team of exceptional, hands-on engineers to make this happen. Mechanical, electrical, hardware, computer, and process. We’ll own the stack from atoms to architecture. Our team is optimistic about the future and we want to continue pushing the limits of technology. Smaller is better. Faster is better. Building it ourselves is better. We believe our team and lab can build anything. We’ve set up 3D printers, a wide array of microscopes, e-beam writers, general fabrication equipment - and whatever is missing, we’ll just invent along the way. Atomic was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the role As a Process Development Engineer at Atomic Semi, you'll bridge the critical interface between BEOL processing and advanced packaging, developing novel integration schemes for next-generation semiconductor devices. We're looking for someone with hands-on experience in interconnect metallization, dielectric processes, or chip-to-package connections, combined with an eagerness to push beyond conventional approaches. You'll need to digest complex technical literature while translating nanofabrication fundamentals into practical process solutions. This is a high-ownership role with lots of autonomy in a fast-moving startup environment. You’ll have the opportunity to contribute to novel R&D processes and influence tool design. Candidates should have hands-on cleanroom experience and a track record of developing nanofabrication recipes from scratch, ideally across multiple process steps. Responsibilities Develop and optimize bond pad structures (e.g., UBM, RDL pads, and other interconnect schemes) for advanced packaging applications
Characterize material interfaces using SEM, EDX, and electrical testing to ensure reliable chip-to-package connections
Generate process specifications and transfer recipes from R&D to production
Collaborate with packaging team to troubleshoot issues related to BEOL structures
Analyze failure modes at the BEOL-package interface and implement corrective actions
Required Experience PhD in Materials Science, Chemical Engineering, Electrical Engineering, or related field (or MS with 2+ years relevant experience)
Hands-on experience with at least one BEOL process: interconnect metallization, dielectric deposition, UBM, or bond pad fabrication
Understanding of chip attach processes and their interaction with BEOL structures
Experience with material characterization techniques (SEM, cross-sectioning, electrical testing)
Nice-to-have Experience with flip-chip, WLCSP, or advanced packaging technologies
Working at Atomic Semi We’re an early-stage hardware startup with solid funding, world-class advisors, and a lab/office in San Francisco, CA. Compensation:
Atomic Semi is committed to fair and equitable compensation practices. The annual salary range for this role is $117,000 – $188,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in Atomic Semi. Benefits:
Atomic Semi offers the following benefits, subject to applicable eligibility requirements: Medical, Dental, and Vision insurance
Generous Paid Time Off inclusive of Holidays and Sick Time
Visa Sponsorship
Life and Disability Insurance
Paid Parental Leave
401(k) retirement plan
Weekly Learning & Development opportunities
Commuter Benefits including Parking and Late Night Uber rides from the office
Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses. Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.
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