ClearanceJobs
Electrical Engineer Ordnance Electronics Design
ClearanceJobs, Cincinnati, Ohio, United States, 45208
Electrical Engineer Ordnance Electronics Design
Location: Cincinnati, OH (On-Site/Office) Duration: 12 months Temp-to-Perm: Yes Pay Rate: $55$60/hr W2 Schedule: 4/10s (MondayThursday, flexible start time) Citizenship Requirement: US Citizenship required (must be able to pass a Secret clearance in the future) Work Environment: 70% office/cubicle, 30% production floor/lab Essential Functions
Design analog and digital ruggedized electronics for ordnance applications Perform circuit tolerance analyses (hand calculations and Spice tools) Develop and refine requirements; ensure compliance Create test plans and reports (Brassboard, Design Verification, Qualification, Firing Properties) Conduct testing throughout the product development cycle Support failure investigations using structured tools (8D, Fishbone, Cause & Effect) Prepare materials for design reviews Generate Engineering Orders (EOs) and Engineering Change Proposals (ECPs) Manage multiple projects simultaneously Qualifications
Bachelor's in Electrical/Computer Engineering + 4 years experience OR Master's + 2 years OR 8+ years of relevant experience without a degree 4+ years: analog design (amplifiers, op amps, LDOs, filters, data converters) 3+ years: digital design (logic gates, flip flops, timers, filters) 2+ years: power supply and conditioning design 2+ years: power conversion (AC/DC, DC/DC, DC/AC, linear/switching) 2+ years: serial communication (UART, SPI, I2C) 2+ years: sensor integration (temperature, MEMs, pressure, gyros) 2+ years: EMI/ESD/short circuit protection 4+ years: module design (component selection, analysis, layout) 4+ years: troubleshooting with lab equipment 3+ years: modeling/simulation (LTSpice, MATLAB/Simulink) 3+ years: schematic capture/board layout (Altium, PADS) 3+ years: leading large-scale technical projects 3+ years: design reviews (internal/external) 3+ years: technical documentation (test plans, reports, drawings) 2+ years: root cause analysis Preferred Skills: BSEE/CompE + 7 years experience 2+ years: ESAD/ISD design per MIL-STD-1316 and MIL-STD-1901A 2+ years: presenting designs to Safety Review Boards (AFSRB, FISTRP, NNMSB) 2+ years: energetic materials interfacing/testing (EFDIs, LEEFIs, Lead Charges, Boosters) 2+ years: design for extreme environments (vibration, shock, temperature, humidity) Strong cross-disciplinary communication and teamwork Project Focus
Product development of ruggedized electronics for ordnance applications Soft Skills Required
Teamwork Strong communication (including presentations and customer interaction) Reprioritization ability Independent work capability
Location: Cincinnati, OH (On-Site/Office) Duration: 12 months Temp-to-Perm: Yes Pay Rate: $55$60/hr W2 Schedule: 4/10s (MondayThursday, flexible start time) Citizenship Requirement: US Citizenship required (must be able to pass a Secret clearance in the future) Work Environment: 70% office/cubicle, 30% production floor/lab Essential Functions
Design analog and digital ruggedized electronics for ordnance applications Perform circuit tolerance analyses (hand calculations and Spice tools) Develop and refine requirements; ensure compliance Create test plans and reports (Brassboard, Design Verification, Qualification, Firing Properties) Conduct testing throughout the product development cycle Support failure investigations using structured tools (8D, Fishbone, Cause & Effect) Prepare materials for design reviews Generate Engineering Orders (EOs) and Engineering Change Proposals (ECPs) Manage multiple projects simultaneously Qualifications
Bachelor's in Electrical/Computer Engineering + 4 years experience OR Master's + 2 years OR 8+ years of relevant experience without a degree 4+ years: analog design (amplifiers, op amps, LDOs, filters, data converters) 3+ years: digital design (logic gates, flip flops, timers, filters) 2+ years: power supply and conditioning design 2+ years: power conversion (AC/DC, DC/DC, DC/AC, linear/switching) 2+ years: serial communication (UART, SPI, I2C) 2+ years: sensor integration (temperature, MEMs, pressure, gyros) 2+ years: EMI/ESD/short circuit protection 4+ years: module design (component selection, analysis, layout) 4+ years: troubleshooting with lab equipment 3+ years: modeling/simulation (LTSpice, MATLAB/Simulink) 3+ years: schematic capture/board layout (Altium, PADS) 3+ years: leading large-scale technical projects 3+ years: design reviews (internal/external) 3+ years: technical documentation (test plans, reports, drawings) 2+ years: root cause analysis Preferred Skills: BSEE/CompE + 7 years experience 2+ years: ESAD/ISD design per MIL-STD-1316 and MIL-STD-1901A 2+ years: presenting designs to Safety Review Boards (AFSRB, FISTRP, NNMSB) 2+ years: energetic materials interfacing/testing (EFDIs, LEEFIs, Lead Charges, Boosters) 2+ years: design for extreme environments (vibration, shock, temperature, humidity) Strong cross-disciplinary communication and teamwork Project Focus
Product development of ruggedized electronics for ordnance applications Soft Skills Required
Teamwork Strong communication (including presentations and customer interaction) Reprioritization ability Independent work capability