Analog Devices
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Staff Engineer, Semi Packaging Engineering
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Analog Devices 2 days ago Be among the first 25 applicants Join to apply for the
Staff Engineer, Semi Packaging Engineering
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Analog Devices Get AI-powered advice on this job and more exclusive features. About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and Twitter (X). About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and Twitter (X).
We are seeking a highly motivated and experienced Staff Packaging Engineer to lead and support advanced semiconductor package development for ADIs smart switch products and other power devices.
Key Responsibilities
Lead the package design, material selection, simulation, process development, qualification, and release-to-manufacturing to deliver robust, cost-effective packaging solutions. Collaborate with cross-functional teams including business units, product engineering, reliability, and supply chain to define packaging needs and drive solutions from concept through production. Interface with OSATs and vendors for new package development, design iterations, prototype builds, and process optimization. Lead reliability assessments, failure analysis, and qualification activities to ensure product robustness in harsh operating environments. Manage multiple packaging development projects with ownership of schedule, quality, and technical deliverables.
Minimum Qualifications
Masters degree in Mechanical Engineering, Materials Science, or Electrical Engineering. 5+ years of relevant experience in IC or power packaging, preferably involving SiC or GaN power device packaging. Strong understanding of packaging materials, mechanical design principles, and thermal management techniques. Experience with package reliability requirements, failure analysis techniques, and assembly process development. Familiarity with process control methodologies such as FMEA, DOE, SPC, and PCN. Excellent project management, communication, and cross-functional collaboration skills. Experience managing OSATs and external suppliers for NPI and high-volume production. Experience with power module or high-voltage packaging for automotive applications is a plus. Hands-on experience with FEA tools (e.g., ANSYS Mechanical, FloTHERM) and 3D CAD modeling (e.g., SolidWorks) is a plus.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $106,500 to $159,750.
Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits. Seniority level
Seniority level
Mid-Senior level Employment type
Employment type
Full-time Job function
Job function
Engineering and Information Technology Industries
Semiconductor Manufacturing Referrals increase your chances of interviewing at Analog Devices by 2x Sign in to set job alerts for Packaging Engineer roles.
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Staff Engineer, Semi Packaging Engineering
role at
Analog Devices 2 days ago Be among the first 25 applicants Join to apply for the
Staff Engineer, Semi Packaging Engineering
role at
Analog Devices Get AI-powered advice on this job and more exclusive features. About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and Twitter (X). About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and Twitter (X).
We are seeking a highly motivated and experienced Staff Packaging Engineer to lead and support advanced semiconductor package development for ADIs smart switch products and other power devices.
Key Responsibilities
Lead the package design, material selection, simulation, process development, qualification, and release-to-manufacturing to deliver robust, cost-effective packaging solutions. Collaborate with cross-functional teams including business units, product engineering, reliability, and supply chain to define packaging needs and drive solutions from concept through production. Interface with OSATs and vendors for new package development, design iterations, prototype builds, and process optimization. Lead reliability assessments, failure analysis, and qualification activities to ensure product robustness in harsh operating environments. Manage multiple packaging development projects with ownership of schedule, quality, and technical deliverables.
Minimum Qualifications
Masters degree in Mechanical Engineering, Materials Science, or Electrical Engineering. 5+ years of relevant experience in IC or power packaging, preferably involving SiC or GaN power device packaging. Strong understanding of packaging materials, mechanical design principles, and thermal management techniques. Experience with package reliability requirements, failure analysis techniques, and assembly process development. Familiarity with process control methodologies such as FMEA, DOE, SPC, and PCN. Excellent project management, communication, and cross-functional collaboration skills. Experience managing OSATs and external suppliers for NPI and high-volume production. Experience with power module or high-voltage packaging for automotive applications is a plus. Hands-on experience with FEA tools (e.g., ANSYS Mechanical, FloTHERM) and 3D CAD modeling (e.g., SolidWorks) is a plus.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) may have to go through an export licensing review process.
Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.
EEO is the Law: Notice of Applicant Rights Under the Law.
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $106,500 to $159,750.
Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors. This position qualifies for a discretionary performance-based bonus which is based on personal and company factors. This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits. Seniority level
Seniority level
Mid-Senior level Employment type
Employment type
Full-time Job function
Job function
Engineering and Information Technology Industries
Semiconductor Manufacturing Referrals increase your chances of interviewing at Analog Devices by 2x Sign in to set job alerts for Packaging Engineer roles.
Warehouse and Packaging Assistant (Second Shift) - Lamplighter Brewing Co.
Packaging Team Lead - 2:00pm to 10:30pm (Canton, MA)
Field Safety Engineer, Mechatronics and Sustainable Packaging
North Reading, MA $81,400.00-$182,000.00 2 days ago Marlborough, MA $66,000.00-$130,000.00 3 days ago Manufacturing Engineer- Process Planning (US Citizen Required)
3DIC Packaging SI/PI Applications Engineer
Manufacturing Engineer - Process Planning
Warehouse and Packaging Assistant (Second Shift) - Lamplighter Brewing Co.
Nashua, NH $63,000.00-$79,000.00 1 week ago Chelmsford, MA $108,800.00-$149,600.00 2 weeks ago Process Mechanical Water and Wastewater Engineer
Chelmsford, MA $120,000.00-$135,000.00 2 months ago Boston, MA $85,000.00-$115,000.00 5 days ago Andover, MA $85,000.00-$115,000.00 5 days ago Were unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI. #J-18808-Ljbffr