Job Description
Package Design Engineer at Broadcom
Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for AI, networking, HPC, and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You\'ll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
Responsibilities
- Overall design responsibility for ASIC package designs, including signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our team of package engineering experts.
- Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
- Schedule, prioritize, and track your work across multiple projects
- General flip-chip BGA package design and engineering
- Project management and customer interface for your design projects
- Contribute to efficiency improvements for the design team through process development/improvement, automation, documentation, etc.
- Physical design (layout) is a foundational responsibility in this role
Education/Experience & Requirements
- BSEE or similar field with 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes; or MSEE or similar field with 10+ years’ experience
- Knowledge of package-level signal integrity and power integrity to apply to package designs
- Cadence APD (Allegro Package Designer) experience is preferred. Equivalent tool is OK.
- Ability to cooperate with a worldwide team across multiple time zones, including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- Preferred candidates will have 1+ years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest
Other Requirements
- This job requires working on-site at the Broadcom office, 5-days a week. This is not a remote-work position
Additional Job Description: Compensation And Benefits
The annual base salary range for this position is $141,300 - $226,000. This position is eligible for a discretionary annual bonus and equity in accordance with relevant plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(k) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Seniority level
- Mid-Senior level
Employment type
- Full-time
Job function
- Engineering and Information Technology
Industries
- Semiconductor Manufacturing