BizLink Group
AI Data Center High-Speed Interconnect Architect
BizLink Group, Fremont, California, us, 94537
AI Data Center High-Speed Interconnect Architect
BizLink Group is seeking an AI Data Center High-Speed Interconnect Architect to define and engineer the architecture for advanced high-speed interconnect systems integral to next-generation AI servers and rack configurations. This role includes the development of technologies such as high-speed backplanes (NVLINK, UALINK, EXAMAX 2), co-packaged copper, high-speed flyover cables, PCIe, CXL, OSFP, OSFP-X, 448G/lane technology, and sophisticated onboard connectors. The architect will ensure these solutions satisfy bandwidth, latency, signal integrity, scalability, and reliability requirements within high-density AI and HPC environments. The role requires close collaboration with interdisciplinary teams and active participation in industry standardization bodies to propel innovation and adoption. Responsibilities
Architectural Design and Optimization: Architect and optimize high-speed interconnect solutions, including backplanes, co-packaged copper, flyover cables, OSFP, OSFP-X, and onboard connectors for AI/ML and HPC platforms. Balance performance, signal integrity, power consumption, cost efficiency, and manufacturing feasibility. Technology Assessment: Lead assessment and selection of interconnect technologies (e.g., NVLINK, UALINK, EXAMAX 2, PCIe, CXL), considering standards evolution and future scalability. Signal and Power Integrity Management: Collaborate with SI/PI engineers to ensure robust high-speed data transmission and adherence to electrical and EMI/EMC standards. Interdepartmental Collaboration: Work with hardware, system, packaging, and software teams to integrate interconnect solutions into AI server and rack architectures. Industry Standards Participation: Represent the organization in standards bodies (e.g., OCP, PCI-SIG, UALINK, IEEE, CXL Consortium), influence next-generation interconnect standards, and monitor industry trends. Client and Partner Liaison: Engage with hyperscalers, OEMs, and technology partners to gather requirements, address challenges, and foster collaborative development of solutions. Technical Documentation and Strategic Planning: Author technical specifications and architecture documents; contribute to the product roadmap for high-speed interconnects. Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. Minimum of 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for compute, networking, or AI platforms. Extensive expertise in high-speed protocols (NVLINK, UALINK, EXAMAX 2, PCIe, CXL, Ethernet, InfiniBand, OSFP, OSFP-X) and advanced connector/cabling technologies. Comprehensive knowledge of signal integrity, power integrity, PCB/package/system design, and relevant simulation tools. Proven experience participating in or influencing industry standards development. Exceptional communication and cross-functional leadership skills. Familiarity with hardware/software co-design and performance analysis for AI/HPC workloads is advantageous. Equal Employment Opportunity
BizLink Technology, Inc. is an equal opportunity employer and is committed to providing a work environment free from discrimination. We celebrate diversity and are dedicated to creating an inclusive workplace for all employees. All employment decisions at BizLink Technology, Inc. are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, age, disability, or any other status protected by law. Compensation
The salary range provided for this position is based on the anticipated compensation for a candidate with relevant experience and qualifications. Final offers may vary depending on skills, experience, and other factors. Compensation details will be discussed during the interview process. Seniority level
Mid-Senior level Employment type
Full-time Job function
Design, Manufacturing, and Product Management Industries
Appliances, Electrical, and Electronics Manufacturing
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BizLink Group is seeking an AI Data Center High-Speed Interconnect Architect to define and engineer the architecture for advanced high-speed interconnect systems integral to next-generation AI servers and rack configurations. This role includes the development of technologies such as high-speed backplanes (NVLINK, UALINK, EXAMAX 2), co-packaged copper, high-speed flyover cables, PCIe, CXL, OSFP, OSFP-X, 448G/lane technology, and sophisticated onboard connectors. The architect will ensure these solutions satisfy bandwidth, latency, signal integrity, scalability, and reliability requirements within high-density AI and HPC environments. The role requires close collaboration with interdisciplinary teams and active participation in industry standardization bodies to propel innovation and adoption. Responsibilities
Architectural Design and Optimization: Architect and optimize high-speed interconnect solutions, including backplanes, co-packaged copper, flyover cables, OSFP, OSFP-X, and onboard connectors for AI/ML and HPC platforms. Balance performance, signal integrity, power consumption, cost efficiency, and manufacturing feasibility. Technology Assessment: Lead assessment and selection of interconnect technologies (e.g., NVLINK, UALINK, EXAMAX 2, PCIe, CXL), considering standards evolution and future scalability. Signal and Power Integrity Management: Collaborate with SI/PI engineers to ensure robust high-speed data transmission and adherence to electrical and EMI/EMC standards. Interdepartmental Collaboration: Work with hardware, system, packaging, and software teams to integrate interconnect solutions into AI server and rack architectures. Industry Standards Participation: Represent the organization in standards bodies (e.g., OCP, PCI-SIG, UALINK, IEEE, CXL Consortium), influence next-generation interconnect standards, and monitor industry trends. Client and Partner Liaison: Engage with hyperscalers, OEMs, and technology partners to gather requirements, address challenges, and foster collaborative development of solutions. Technical Documentation and Strategic Planning: Author technical specifications and architecture documents; contribute to the product roadmap for high-speed interconnects. Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. Minimum of 10 years of professional experience in high-speed interconnect architecture, signal integrity, or system design for compute, networking, or AI platforms. Extensive expertise in high-speed protocols (NVLINK, UALINK, EXAMAX 2, PCIe, CXL, Ethernet, InfiniBand, OSFP, OSFP-X) and advanced connector/cabling technologies. Comprehensive knowledge of signal integrity, power integrity, PCB/package/system design, and relevant simulation tools. Proven experience participating in or influencing industry standards development. Exceptional communication and cross-functional leadership skills. Familiarity with hardware/software co-design and performance analysis for AI/HPC workloads is advantageous. Equal Employment Opportunity
BizLink Technology, Inc. is an equal opportunity employer and is committed to providing a work environment free from discrimination. We celebrate diversity and are dedicated to creating an inclusive workplace for all employees. All employment decisions at BizLink Technology, Inc. are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, age, disability, or any other status protected by law. Compensation
The salary range provided for this position is based on the anticipated compensation for a candidate with relevant experience and qualifications. Final offers may vary depending on skills, experience, and other factors. Compensation details will be discussed during the interview process. Seniority level
Mid-Senior level Employment type
Full-time Job function
Design, Manufacturing, and Product Management Industries
Appliances, Electrical, and Electronics Manufacturing
#J-18808-Ljbffr