Celestica
Staff Thermal Engineer, Thermal Hardware Design
Celestica, San Jose, California, United States, 95199
Overview
Staff Thermal Engineer, Thermal Hardware Design Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with 3D software applications. Responsibilities
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. Plan your work to achieve full required performance, and stay on schedule to support overall product development. Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording. Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness. Work with multi-disciplinary groups to define system requirements and design products. Work with cross-functional teams to identify root causes of system performance. Qualifications
Master’s degree in Engineering. Preference given to candidates with a Master’s degree in Thermodynamic Engineering. Educational requirements may vary by Geography. Salary
Base pay range: $128,000.00/yr - $200,000.00/yr Company and Compliance
Celestica is a global hardware platform and solutions provider. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. Celestica is an equal opportunity employer and prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law. This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment. Retaliation against individuals who file discrimination charges is not tolerated. All information will be kept confidential according to EEO guidelines. This location is a US ITAR facility and may involve release of export controlled goods. Necessary information will be collected to determine if export control exemptions or licenses must be filed. Notes
This job description is not intended to be exhaustive. Duties and time allocation may change. Celestica is an equal opportunity employer. If applicable, this position reflects California or other geography-specific postings.
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Staff Thermal Engineer, Thermal Hardware Design Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with 3D software applications. Responsibilities
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. Plan your work to achieve full required performance, and stay on schedule to support overall product development. Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording. Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness. Work with multi-disciplinary groups to define system requirements and design products. Work with cross-functional teams to identify root causes of system performance. Qualifications
Master’s degree in Engineering. Preference given to candidates with a Master’s degree in Thermodynamic Engineering. Educational requirements may vary by Geography. Salary
Base pay range: $128,000.00/yr - $200,000.00/yr Company and Compliance
Celestica is a global hardware platform and solutions provider. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. Celestica is an equal opportunity employer and prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law. This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment. Retaliation against individuals who file discrimination charges is not tolerated. All information will be kept confidential according to EEO guidelines. This location is a US ITAR facility and may involve release of export controlled goods. Necessary information will be collected to determine if export control exemptions or licenses must be filed. Notes
This job description is not intended to be exhaustive. Duties and time allocation may change. Celestica is an equal opportunity employer. If applicable, this position reflects California or other geography-specific postings.
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