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Micron Technology

Memory Innovation Engineer, AI and Machine Learning

Micron Technology, Boise, Idaho, United States, 83708

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Memory Innovation Engineer, AI and Machine Learning

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Micron Technology Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Cloud Memory Business Unit (CMBU) Memory Innovation team is dedicated to pioneering next-generation memory solutions for Datacenter and AI architectures. We work closely with internal and external partners to shape the future of memory technologies and guide strategic investments. We are seeking a Memory Innovation Engineer to perform research for CMBU, focusing on advanced memory architectures as applicable to the rapidly growing AI/ML space with a focus on data center and cloud applications. Applicants for this position will engage in extensive technical collaboration, collaborate closely with internal leadership, and engage with external industry. Responsibilities

Develop and implement a forward-looking innovative strategy for memory technologies in Datacenter and AI. Collaborate with internal teams and external partners to solve complex technical challenges and identify growth opportunities. Contribute to the formulation of the business unit’s strategy related to memory technology investments, considering market trends, manufacturability, and ecosystem dynamics. Influence industry and customer directions to enhance CMBU’s long-term portfolio. Minimum Qualifications

Ph.D. in Electrical Engineering, Computer Science. Educational background focused on Hardware Architecture or systems design with a focus on (GPU, CPU, ASIC, chiplet, packaging, datacenter systems). Ability to analyze complex memory and AI performance challenges. Preferred Qualifications

Understanding of memory hardware architectures and their impact on AI performance. Exposure to DRAM-related experience in design, engineering, quality, architecture. Understanding of near-memory solutions (3D stacking, chiplet, interposer) and system-level trade-offs. Strong collaboration and interpersonal skills. Compensation and Benefits

The US base salary range for this full-time position is $105,500.00 - $270,000.00. The range reflects the minimum and maximum target for new hire salaries across all US locations. Within the range, pay is determined by work location and factors such as knowledge, skills, experience, tenure and education. Additional compensation may include benefits, discretionary bonuses and equity. Micron benefits include medical, dental and vision plans, paid time off, paid holidays, short- and long-term disability protections, paid family leave, and more. For more information, see the Benefits Guide at micron.com/careers/benefits. Equal Opportunity

Micron is an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable laws. To learn about your right to work, click here. To learn more about Micron, please visit micron.com/careers. US sites: for assistance with the application process or reasonable accommodations, contact hrsupport_na@micron.com or 1-800-336-8918 (option #3). Micron prohibits child labor and complies with all applicable laws and standards. Micron does not charge candidates any recruitment fees or collect any payment from candidates for employment. Notes

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information must be accurate and reflect true skills and experiences. Misuse of AI to fabricate qualifications will result in disqualification.

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