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Microsoft Corporation

Principal Firmware Engineer

Microsoft Corporation, Hillsboro, Oregon, United States, 97104

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Overview

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Principal Firmware Engineer

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Microsoft . Join the Strategic Planning and Architecture (SPARC) team within Microsofts Azure Hardware Systems and Infrastructure (AHSI) organization, the team behind Microsofts expanding Cloud Infrastructure and for powering Microsofts Intelligent Cloud mission. Microsoft delivers more than 200 online services to more than one billion individuals worldwide, and AHSI supports the core infrastructure and foundational technologies for Microsofts cloud businesses. Responsibilities Involved in all phases of product development, ensuring seamless integration from concept to deployment Participate in silicon design, collaborating closely with hardware teams to define firmware requirements Drive firmware architecture and design, setting foundational patterns and best practices for the development team Support manufacturing efforts, enabling smooth bring-up and validation of hardware platforms Lead productization, ensuring the firmware is robust, reliable, and ready for mass production Lead driver and firmware architecture/design for accelerator chips, focusing on performance, scalability, and maintainability Contribute to firmware development at all levels of the stack, from low-level hardware interaction to driver integration Design and implement driver interfaces, enabling communication between hardware and higher-level software components Develop power-on and initialization routines for silicon bring-up and early boot scenarios Implement and optimize protocols and feature support for low-level hardware capabilities

Qualifications

Required/minimum qualifications:

Bachelors Degree in Computer Science or related technical field AND 6+ years of technical engineering experience with coding in languages including, but not limited to, C, C++, C#, Java, JavaScript, or Python OR equivalent experience 5+ years of experience designing Windows/Linux Driver/OS development 5+ years of experience with developing PCIe, USB, DMA, IOMMU 5+ years of experience Linux and Windows Kernel debugging

Other Requirements:

Ability to meet Microsoft, customer and/or government security screening requirements. This includes the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Preferred Qualifications:

Experienced with ROM, Bootloader, and embedded runtime development; experience in pre-silicon environments; familiarity with I3C, I2C, SPI, SPI-FLASH; ability to debug and resolve issues spanning multiple subsystems; proven and demonstrable skill in Rust; familiarity with standard cryptography algorithms.

Compensation and Benefits

Software Engineering IC5 - The typical base pay range for this role across the U.S. is USD $139,900 - $274,800 per year. In certain locations (San Francisco Bay Area and New York City metropolitan area), the base pay range is USD $188,000 - $304,200 per year. Some roles may be eligible for benefits and other compensation. More pay information is available here: https://careers.microsoft.com/us/en/us-corporate-pay Microsoft will accept applications for the role until September 8, 2025. Microsoft is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, or other protected characteristics. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations. Location and other job details may be listed, but final eligibility and details will be determined by Microsoft during the hiring process. Job Details

Seniority level: Not Applicable Employment type: Full-time Job function: Engineering and Information Technology Industries: Software Development

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