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Sr Staff or Principal Thermal Engineer, Server Packaging
-, San Diego, California, United States, 92189
Overview
Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Responsibilities
Lead thermal architecture solutions through simulation and test while working with various stakeholders. Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase. Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations. Develop custom SW solutions to automate thermal modeling and test. Conduct thermal tests to validate/characterize models and present results to stakeholders. Analyze and document simulation and test results. Education
Required: MS in Mechanical Engineering Preferred: PhD in Mechanical Engineering Requirements
10+ years of industry experience in electronics cooling related to server products. Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan. Industry exposure to 2.5/3D packaging is highly desirable. Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development. Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC. Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment. Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable. Excellent presentation, negotiation, and communication skills. Ability to clearly communicate complex technical content in written and verbal formats. Some experience with AI/ML concepts, algorithms, and methodologies is a plus. Additional Information
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm provides accessible processes. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. EEO
Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Pay and Benefits
Pay range:
$180,400.00 - $270,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is one component of total compensation at Qualcomm, which may include a discretionary bonus program and RSU grants. Our benefits package is designed to support success at work, at home, and at play. Your recruiter can discuss details about Qualcomm benefits.
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Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Responsibilities
Lead thermal architecture solutions through simulation and test while working with various stakeholders. Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase. Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations. Develop custom SW solutions to automate thermal modeling and test. Conduct thermal tests to validate/characterize models and present results to stakeholders. Analyze and document simulation and test results. Education
Required: MS in Mechanical Engineering Preferred: PhD in Mechanical Engineering Requirements
10+ years of industry experience in electronics cooling related to server products. Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan. Industry exposure to 2.5/3D packaging is highly desirable. Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development. Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC. Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment. Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable. Excellent presentation, negotiation, and communication skills. Ability to clearly communicate complex technical content in written and verbal formats. Some experience with AI/ML concepts, algorithms, and methodologies is a plus. Additional Information
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm provides accessible processes. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. EEO
Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Pay and Benefits
Pay range:
$180,400.00 - $270,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is one component of total compensation at Qualcomm, which may include a discretionary bonus program and RSU grants. Our benefits package is designed to support success at work, at home, and at play. Your recruiter can discuss details about Qualcomm benefits.
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