AvicenaTech
Optical Packaging/Component Engineer
AvicenaTech, Sunnyvale, California, United States, 94087
Avicena
is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:
Develop and test packaging solutions for multi-lane optical interconnects.
Design and test optical sub-assemblies with arrays of optical fibers. Design multi-fiber optical connectors and work with external vendors to develop connector eco-system. Design micro-array assembly process, fixture and tooling development. Work with optical fibers, optical launch optimization and optical loss testing. Develop mechanical/optomechanical test procedures. Perform micron level assembly techniques. Measure material properties and interactions (e.g. epoxy selection, CTE, stress) Component reliability and qualification testing. Requirements
:
5+ years' experience in Opto-Mechanical or Optical Packaging field. M.S. degree or higher in Opto-Mechanical Engineering, Physics, or equivalent field. Preferred experience with Optical Transceiver assembly, Silicon Photonics or Co-Packaged Optics Hands-on expertise with mechanical design software (e.g. Solidworks) and mechanical modeling simulations Experience with optical modelling software (e.g. Zemax, LightTools) is an asset Knowledge of micro-replication techniques and polymer molding is an asset Ability to work independently in a fast-paced startup environment Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.
is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:
Develop and test packaging solutions for multi-lane optical interconnects.
Design and test optical sub-assemblies with arrays of optical fibers. Design multi-fiber optical connectors and work with external vendors to develop connector eco-system. Design micro-array assembly process, fixture and tooling development. Work with optical fibers, optical launch optimization and optical loss testing. Develop mechanical/optomechanical test procedures. Perform micron level assembly techniques. Measure material properties and interactions (e.g. epoxy selection, CTE, stress) Component reliability and qualification testing. Requirements
:
5+ years' experience in Opto-Mechanical or Optical Packaging field. M.S. degree or higher in Opto-Mechanical Engineering, Physics, or equivalent field. Preferred experience with Optical Transceiver assembly, Silicon Photonics or Co-Packaged Optics Hands-on expertise with mechanical design software (e.g. Solidworks) and mechanical modeling simulations Experience with optical modelling software (e.g. Zemax, LightTools) is an asset Knowledge of micro-replication techniques and polymer molding is an asset Ability to work independently in a fast-paced startup environment Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.