Micron Technology
Distinguished Member of Technical Staff, Package Simulation
Micron Technology, Boise, Idaho, United States, 83708
Our vision is to transform how the world uses information to enrich life for
all
.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Join Micron in an outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor Package Simulation & Architecture Engineer, you will be at the forefront of innovation, crafting flawless designs from concept to market.
This position is developed for a highly skilled professional with deep expertise in packaging, thermal/mechanical & electrical simulation along with product architecture. You will coordinate technology staging, leading all aspects of electrical, mechanical, and logical requirements. Your role involves ensuring package development aligns with both product and system integration goals through extensive collaboration with multi-functional teams!
Responsibilities
Perform electrical and thermomechanical simulations using tools like Ansys HFSS, SIwave, Abaqus, and COMSOL to evaluate signal integrity, power integrity, and reliability.
Develop and optimize advanced packaging solutions including FC-BGA, SiP, and 2.5D/3D IC technologies, with expertise in substrate and interposer design.
Apply DFM and DFx principles to ensure manufacturability, testability, and cost-effectiveness of package designs.
Use CAD and package design tools such as Cadence Allegro, Mentor Graphics, and AutoCAD for layout and composition.
Architect packaging solutions that meet power, performance, area, and reliability (PPAR) targets while integrating silicon and system-level constraints.
Align package, board, and system requirements through collaboration with platform and system architects.
Solve complex electrical and mechanical challenges using simulation and empirical data to improve reliability and performance.
Communicate technical concepts clearly across disciplines and contribute to documentation, specifications, and mentoring efforts.
Qualifications
PhD or Master's degree in Electrical Engineering or Mechanical Engineering.
15+ years of relevant experience in semiconductor packaging engineering or related fields.
Demonstrated success in fixing intricate electrical and mechanical issues within packaging and interconnect structures.
Experience with package simulation, package development, Product Architecture and system integration
Excellent verbal and written communication skills; ability to convey sophisticated technical concepts to diverse audiences.
Preferred Qualifications
Analytical and problem solving skills
Understanding of industry standards (JEDEC, IPC, IEEE) and regulatory compliance as it relates to packaging materials and structures.
Authorship of patents and publications in the field of packaging technology.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$221,000.00 - $442,000.00
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your
right to work click here. (http://www.justice.gov/crt/worker-information)
To learn more about Micron, please visit micron.com/careers
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert
:
Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
all
.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Join Micron in an outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor Package Simulation & Architecture Engineer, you will be at the forefront of innovation, crafting flawless designs from concept to market.
This position is developed for a highly skilled professional with deep expertise in packaging, thermal/mechanical & electrical simulation along with product architecture. You will coordinate technology staging, leading all aspects of electrical, mechanical, and logical requirements. Your role involves ensuring package development aligns with both product and system integration goals through extensive collaboration with multi-functional teams!
Responsibilities
Perform electrical and thermomechanical simulations using tools like Ansys HFSS, SIwave, Abaqus, and COMSOL to evaluate signal integrity, power integrity, and reliability.
Develop and optimize advanced packaging solutions including FC-BGA, SiP, and 2.5D/3D IC technologies, with expertise in substrate and interposer design.
Apply DFM and DFx principles to ensure manufacturability, testability, and cost-effectiveness of package designs.
Use CAD and package design tools such as Cadence Allegro, Mentor Graphics, and AutoCAD for layout and composition.
Architect packaging solutions that meet power, performance, area, and reliability (PPAR) targets while integrating silicon and system-level constraints.
Align package, board, and system requirements through collaboration with platform and system architects.
Solve complex electrical and mechanical challenges using simulation and empirical data to improve reliability and performance.
Communicate technical concepts clearly across disciplines and contribute to documentation, specifications, and mentoring efforts.
Qualifications
PhD or Master's degree in Electrical Engineering or Mechanical Engineering.
15+ years of relevant experience in semiconductor packaging engineering or related fields.
Demonstrated success in fixing intricate electrical and mechanical issues within packaging and interconnect structures.
Experience with package simulation, package development, Product Architecture and system integration
Excellent verbal and written communication skills; ability to convey sophisticated technical concepts to diverse audiences.
Preferred Qualifications
Analytical and problem solving skills
Understanding of industry standards (JEDEC, IPC, IEEE) and regulatory compliance as it relates to packaging materials and structures.
Authorship of patents and publications in the field of packaging technology.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$221,000.00 - $442,000.00
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your
right to work click here. (http://www.justice.gov/crt/worker-information)
To learn more about Micron, please visit micron.com/careers
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert
:
Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.