Celestial AI
Overview
As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions. The Photonic Fabric is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies. This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers. About the Role
In this role you will utilize your in-depth 2.5D assembly process experience and partner management experience to drive the company’s AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly development along with strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency. Essential Duties and Responsibilities
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As Generative AI continues to advance, the performance drivers for data center infrastructure are shifting from systems-on-chip (SOCs) to systems of chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric is the next-generation interconnect technology that delivers a tenfold increase in performance and energy efficiency compared to competing solutions. The Photonic Fabric is available to our customers in multiple technology offerings, including optical interface chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This allows customers to easily incorporate high bandwidth, low power, and low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging processes. This seamless integration enables XPUs to utilize optical interconnects for both compute-to-compute and compute-to-memory fabrics, achieving bandwidths in the tens of terabits per second with nanosecond latencies. This innovation empowers hyperscalers to enhance the efficiency and cost-effectiveness of AI processing by optimizing the XPUs required for training and inference, while significantly reducing the TCO2 impact. Celestial AI is developing a Photonic Fabric ecosystem consisting of tier-1 partnerships that include custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers. About the Role
In this role you will utilize your in-depth 2.5D assembly process experience and partner management experience to drive the company’s AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly development along with strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency. Essential Duties and Responsibilities
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