Company Overview:
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.
MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.
Mechanical Engineering, Principal
Job Description:
Support new package design and development by working with ateam ofengineers and designers. Responsiblefor all mechanicalaspects ofnew and legacy designs. Devices range from single chip packagesto subsystem modules.
Key aspects of the role include:
- Ownershipof the compliance of designs to meet mechanical requirements
- Interactionwith customers and ability to negotiate requirements where conflicts mayoccur
- Interactionwith internal design engineers, project managers, assembly and testentities to ensure all aspects of the design are in-line with expectationsacross the company
- Mechanicalanalyses including but not limited to structural, thermal and reliability
- Ownershipand design of assembly and test fixtures
- Understandingof machining best practice and GD&T tolerancing
- Abilityto work with vendors to understand their capabilities in aligning partdesigns with industry capabilities
- Understandingof various manufacturing techniques including subtractive metalfabrication, additive manufacturing, etching, laser cutting, welding andmarking, etc.
- Abilityto work in fast paced environment with small and large teams withlittle-to-no supervision
Qualifications:
Mechanical Engineering Degree or similar with 8+ years ofexperience in an electronics packaging role. Experience with IC packaging,system and subsystem mechanical design and analysis. The ideal candidate willhave experience with RF and millimeter wave types of products.
Key capabilitiesof an ideal candidate are:
- Experiencewith packaging for RF-Power applications, using eutectic and/or sinteredepoxy die attach
- Experiencewith aluminum, copper and other alloys for use in packaging and thermaltransfer
- Understandingand awareness of coefficient of thermal expansion (CTE) matching betweenvarious mediums
- Understandingof metal plating standards and requirements
- Experiencein reliability, failure analysis, and quality assurance in advancedpackage and process development
- Experiencedesigning for manufacturing, both internally and externally, both piece-partand assemblies
- Knowledgeof product characterization, testing, quality and reliability, includingcompliance testing and certification is a plus (MIL-PRF-38534, JEDEC, IPC,etc.)
- Intimateknowledge of structural analysis using 3D CAD tools as well as firstprinciples
- Intimateknowledge of thermal analysis using 3D CAD tools as well as firstprinciples
- Demonstratedability to lead independent process development
- Abilityto provide suppliers direction by working with design, assembly, andquality organizations
- Familiarwith finite element analyses (FEA) required and computational fluiddynamics (CFD) desired
- Familiarsolving steady state and dynamic thermal problems
- Experienceusing: Solidworks, AutoCad, and PCB layout viewers is ideal
- Strongproblem solving skills along with good communication, team work, andinterpersonal skills
- Experiencein critical thinking and presentation skills
- Experiencewith supplier and program management roles
- Experienceworking in complex teams to understand and balance all aspects of a designto meet desired outcomes
- Abilityto balance and prioritize multiple programs and needs simultaneously
- Fluentcommunicator in the English language
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
The Salary Range for this position is $98,000 – $166,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.
EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.
Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call +1-978-656-2500 or email Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.