Cohesive Technologies LLC
Principal Embedded Software Engineer | Qualcomm Chipsets | Redmond, WA | Full-Ti
Cohesive Technologies LLC, Redmond, Washington, United States, 98052
Overview
Cohesive Technologies is a global IT Services & Solutions company providing IT Staffing Services and Application Development Services necessary for technology leaders to deliver business value. We help our people and clients succeed by leveraging our expertise, deep industry and market knowledge, proprietary assessment tools and techniques, and project delivery methodologies. Through relationships with thousands of specialized professionals, we bring an unparalleled ability to match talent with opportunities by assessing, recruiting, developing and engaging the best and brightest people for our clients. We combine broad geographic presence, world-class solutions and a tailored, consultative approach to help our people and clients achieve higher performance and outstanding results. Role
Role:
Principal Embedded Software Engineer Location:
Redmond, WA Position Type:
Full Time Summary:
Principal Embedded Software Engineer to join our team, focusing on the bring-up and optimization of
Qualcomm chipsets
for
cutting-edge devices . In this role, you will be instrumental in the initial bring-up phases, driving
Board Support Package (BSP)
development, and ensuring
robust platform
functionality. You will leverage your deep technical expertise to work with the latest
Qualcomm technologies , including the
Qualcomm 8650 platform , to deliver high-performance and reliable solutions. Responsibilities
Lead the bring-up of new
Qualcomm chipsets
on
custom hardware , from initial power-on to full system functionality. Drive Board Support Package (BSP) development, including bootloaders, kernel modifications, and device drivers, specifically targeting Qualcomm platforms. Debug complex low-level issues spanning hardware, firmware, and software layers during the chipset bring-up process. Collaborate closely with
hardware design teams ,
silicon vendors (Qualcomm) , and software development teams to resolve integration challenges. Optimize system performance, power consumption, and stability for Qualcomm-based platforms. Develop and maintain robust validation and diagnostic tools for
chipset and BSP verification. Contribute to architectural discussions and provide technical leadership for embedded software initiatives. Document technical designs, specifications, and troubleshooting guides for internal and external teams. Direct experience with Qualcomm 8650 (Snapdragon 8 Gen 2/3 series) or similar high-performance Qualcomm mobile/compute chipsets. Experience with bootloaders (e.g., U-Boot, LK), trusted execution environments (TEEs), and secure boot processes. Familiarity with hardware schematics and datasheets. Experience in
power management
and
performance optimization for embedded systems. Knowledge of mobile communication technologies (e.g., 5G, Wi-Fi, Bluetooth) and their integration at the
chipset level. Master’s degree in
Electrical Engineering ,
Computer Science , or a related field. Cohesive Technologies is an equal access/equal opportunity employer and does not discriminate on the basis of age, color, disability, marital status, national origin, race, religion, sex, sexual orientation, veteran status or any other classification prescribed by applicable law.
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Cohesive Technologies is a global IT Services & Solutions company providing IT Staffing Services and Application Development Services necessary for technology leaders to deliver business value. We help our people and clients succeed by leveraging our expertise, deep industry and market knowledge, proprietary assessment tools and techniques, and project delivery methodologies. Through relationships with thousands of specialized professionals, we bring an unparalleled ability to match talent with opportunities by assessing, recruiting, developing and engaging the best and brightest people for our clients. We combine broad geographic presence, world-class solutions and a tailored, consultative approach to help our people and clients achieve higher performance and outstanding results. Role
Role:
Principal Embedded Software Engineer Location:
Redmond, WA Position Type:
Full Time Summary:
Principal Embedded Software Engineer to join our team, focusing on the bring-up and optimization of
Qualcomm chipsets
for
cutting-edge devices . In this role, you will be instrumental in the initial bring-up phases, driving
Board Support Package (BSP)
development, and ensuring
robust platform
functionality. You will leverage your deep technical expertise to work with the latest
Qualcomm technologies , including the
Qualcomm 8650 platform , to deliver high-performance and reliable solutions. Responsibilities
Lead the bring-up of new
Qualcomm chipsets
on
custom hardware , from initial power-on to full system functionality. Drive Board Support Package (BSP) development, including bootloaders, kernel modifications, and device drivers, specifically targeting Qualcomm platforms. Debug complex low-level issues spanning hardware, firmware, and software layers during the chipset bring-up process. Collaborate closely with
hardware design teams ,
silicon vendors (Qualcomm) , and software development teams to resolve integration challenges. Optimize system performance, power consumption, and stability for Qualcomm-based platforms. Develop and maintain robust validation and diagnostic tools for
chipset and BSP verification. Contribute to architectural discussions and provide technical leadership for embedded software initiatives. Document technical designs, specifications, and troubleshooting guides for internal and external teams. Direct experience with Qualcomm 8650 (Snapdragon 8 Gen 2/3 series) or similar high-performance Qualcomm mobile/compute chipsets. Experience with bootloaders (e.g., U-Boot, LK), trusted execution environments (TEEs), and secure boot processes. Familiarity with hardware schematics and datasheets. Experience in
power management
and
performance optimization for embedded systems. Knowledge of mobile communication technologies (e.g., 5G, Wi-Fi, Bluetooth) and their integration at the
chipset level. Master’s degree in
Electrical Engineering ,
Computer Science , or a related field. Cohesive Technologies is an equal access/equal opportunity employer and does not discriminate on the basis of age, color, disability, marital status, national origin, race, religion, sex, sexual orientation, veteran status or any other classification prescribed by applicable law.
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