Celestica Inc.
Lead Thermal Engineer, Hardware Design
Celestica Inc., San Jose, California, United States, 95199
Lead Thermal Engineer, Hardware Design
Date:
Oct 1, 2025 Location:
San Jose, CA, US Celestica is the brand behind the brands you love in tech. We design, develop, and manufacture leading-edge Hardware Platform Solutions in Networking, Storage, and Server solutions from general purpose to customized Cloud, AI, machine learning, Edge and 5G deployments. Our customers experience firsthand the power of our people - people who share a passion for innovation, technology, collaboration, performance and quality. People who, together, make a formidable team that is not only transforming our company, but transforming the technology landscape of the future. Summary
Responsibilities:
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. Plan your work to achieve full required performance, and stay on schedule to support overall product development. Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Analyze test data to draw inferences about the equipment tested. Work with multi-disciplinary groups to define system requirements and design products. Work with cross-functional teams to identify root causes of system performance. Typical Education
Master’s degree in Engineering. Preference giving to candidates with a Master’s degree in Thermodynamic Engineering Celestica is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category under applicable federal, state, and local laws.
#J-18808-Ljbffr
Date:
Oct 1, 2025 Location:
San Jose, CA, US Celestica is the brand behind the brands you love in tech. We design, develop, and manufacture leading-edge Hardware Platform Solutions in Networking, Storage, and Server solutions from general purpose to customized Cloud, AI, machine learning, Edge and 5G deployments. Our customers experience firsthand the power of our people - people who share a passion for innovation, technology, collaboration, performance and quality. People who, together, make a formidable team that is not only transforming our company, but transforming the technology landscape of the future. Summary
Responsibilities:
Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing. Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs. Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products. Conceive and implement ways to enhance and extend operation of heat transfer hardware. Consider the thermal aspects of chip packaging technologies. Apply best-in-class fluid flow geometry and technology to cool high heat flux chips. Determine and consider the effects of contact resistance and the use of Thermal Interface Materials. Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost. Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates. Plan your work to achieve full required performance, and stay on schedule to support overall product development. Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications. Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Analyze test data to draw inferences about the equipment tested. Work with multi-disciplinary groups to define system requirements and design products. Work with cross-functional teams to identify root causes of system performance. Typical Education
Master’s degree in Engineering. Preference giving to candidates with a Master’s degree in Thermodynamic Engineering Celestica is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category under applicable federal, state, and local laws.
#J-18808-Ljbffr