Keysight Technologies
Process Engineer, Heterogeneous Integration
Keysight Technologies, Santa Rosa, California, us, 95402
Overview
Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.
Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.
This position is within the High Frequency Technology Center (HFTC) at our Headquarters in Santa Rosa, CA. At the center of beautiful Sonoma County, just an hour north of San Francisco, you will live close to vineyards, redwood forests, regional and state parks, and a vibrant culinary scene, while developing state-of-the-art semiconductor manufacturing technologies at our worldclass IC and Heterogeneous Integration fabs.
HFTC is part of Keysight Labs, the core R&D organization that enables Centers of Excellence and other business groups to provide RF, microwave, mmWave, 5G and 6G solutions to customers in various industries, including communications, aerospace & defense, automotive & energy, general electronics, manufacturing, and semiconductor industries. HFTC technologies include InP and GaAs-based HBTs, HEMTs, and diodes, as well as high-frequency System in Package (SiP) and PCA subsystem solutions.
Responsibilities We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.
Responsibilities may include:
Develop and maintain wafer fabrication processes
Develop and maintain package assembly processes
Specify, select and qualify new equipment
Contribute to process automation
Review new designs for manufacturability and provide feedback to module designers
Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
Meet accelerated project schedules; communicate and manage risks
Develop and maintain high yields while adhering to project schedules
We are seeking an industry professional with proven expertise in one or more of the following areas:
Design for manufacturing of electromechanical assemblies
Statistical process control (SPC), design of experiments (DOE)
Thermocompression / flip chip bonding
Surface Mount Technology (SMT) processes
Die singulation
Semiconductor fabrication processes
Heterogeneous integration, advanced packaging techniques
New technology introduction
New product introduction
This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross-functional interactions.
Qualifications BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.
Professional experience in the following areas is desired:
III-V compound semiconductors and/or silicon technologies
Thermal, mechanical and electrical reliability
Technical project management, project lifecycle
Santa Rosa, CA Pay Range: USD $119,000.00 - USD $199,340.00 Year
Careers Privacy Statement
Keysight is an Equal Opportunity Employer.
#J-18808-Ljbffr
Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.
This position is within the High Frequency Technology Center (HFTC) at our Headquarters in Santa Rosa, CA. At the center of beautiful Sonoma County, just an hour north of San Francisco, you will live close to vineyards, redwood forests, regional and state parks, and a vibrant culinary scene, while developing state-of-the-art semiconductor manufacturing technologies at our worldclass IC and Heterogeneous Integration fabs.
HFTC is part of Keysight Labs, the core R&D organization that enables Centers of Excellence and other business groups to provide RF, microwave, mmWave, 5G and 6G solutions to customers in various industries, including communications, aerospace & defense, automotive & energy, general electronics, manufacturing, and semiconductor industries. HFTC technologies include InP and GaAs-based HBTs, HEMTs, and diodes, as well as high-frequency System in Package (SiP) and PCA subsystem solutions.
Responsibilities We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.
Responsibilities may include:
Develop and maintain wafer fabrication processes
Develop and maintain package assembly processes
Specify, select and qualify new equipment
Contribute to process automation
Review new designs for manufacturability and provide feedback to module designers
Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
Meet accelerated project schedules; communicate and manage risks
Develop and maintain high yields while adhering to project schedules
We are seeking an industry professional with proven expertise in one or more of the following areas:
Design for manufacturing of electromechanical assemblies
Statistical process control (SPC), design of experiments (DOE)
Thermocompression / flip chip bonding
Surface Mount Technology (SMT) processes
Die singulation
Semiconductor fabrication processes
Heterogeneous integration, advanced packaging techniques
New technology introduction
New product introduction
This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross-functional interactions.
Qualifications BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.
Professional experience in the following areas is desired:
III-V compound semiconductors and/or silicon technologies
Thermal, mechanical and electrical reliability
Technical project management, project lifecycle
Santa Rosa, CA Pay Range: USD $119,000.00 - USD $199,340.00 Year
Careers Privacy Statement
Keysight is an Equal Opportunity Employer.
#J-18808-Ljbffr