Nokia
Silicon Photonics Packaging Engineer Co-op
Nokia, Sunnyvale, California, United States, 94087
Overview
Position Title: Silicon Photonics Packaging Engineer Co-op
Number of Position(s): 1
Duration: 4 Months
Date: January - May 2026
Location: Onsite - Sunnyvale, CA or New York, NY
Education Education Recommendations
Currently a candidate for a Master’s or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in US.
Qualifications
Experience with package and process design/development from design to production.
Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
Experience in high-speed electronics package design and/or laser package design.
Experience with thermo-mechanical simulations using ANSYS or similar software.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
Responsibilities
Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
Own Design Rules documents and ensure Design for Manufacturing specifications are met.
Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
Drive package debug activities during product validation and qualification.
Plan and Drive prototype assembly builds to enable deliveries for early design validation.
Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
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Number of Position(s): 1
Duration: 4 Months
Date: January - May 2026
Location: Onsite - Sunnyvale, CA or New York, NY
Education Education Recommendations
Currently a candidate for a Master’s or PhD degree in Electrical Engineering, Physics, Applied Physics, or other similar field with an accredited school in US.
Qualifications
Experience with package and process design/development from design to production.
Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
Experience in high-speed electronics package design and/or laser package design.
Experience with thermo-mechanical simulations using ANSYS or similar software.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
Responsibilities
Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
Own Design Rules documents and ensure Design for Manufacturing specifications are met.
Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
Drive package debug activities during product validation and qualification.
Plan and Drive prototype assembly builds to enable deliveries for early design validation.
Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
#J-18808-Ljbffr