Air Force Research Laboratory
Senior Microelectronics Design Engineer
Air Force Research Laboratory, Dayton, Ohio, United States, 45444
Overview
This job announcement will be accepting candidate submissions until 10 October 2025. OPEN TO CURRENT AFRL CIVILIAN EMPLOYEES ONLY. The AFRL Sensors Directorate seeks to hire a motivated and experienced senior-level Electronics Engineer (0855) to serve as the Senior Microelectronics Design Engineer in the Advance Packaging Section (AFRL/RYDMP) in the Aerospace Components & Subsystems Division (AFRL/RYD) of the Sensors Directorate (RY) in the Air Force Research Laboratory. This position is open to candidates currently at the DR-02 or equivalent level eligible for promotion and current DR-03 or equivalent level candidates for reassignment. This position will be filled at the DR-03 level and is located at Wright-Patterson Air Force Base in Dayton, Ohio. Your application WILL NOT be considered if all required documents are not submitted. See the list of required documents at the bottom of the announcement.
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This job announcement will be accepting candidate submissions until 10 October 2025. OPEN TO CURRENT AFRL CIVILIAN EMPLOYEES ONLY. The AFRL Sensors Directorate seeks to hire a motivated and experienced senior-level Electronics Engineer (0855) to serve as the Senior Microelectronics Design Engineer in the Advance Packaging Section (AFRL/RYDMP) in the Aerospace Components & Subsystems Division (AFRL/RYD) of the Sensors Directorate (RY) in the Air Force Research Laboratory. This position is open to candidates currently at the DR-02 or equivalent level eligible for promotion and current DR-03 or equivalent level candidates for reassignment. This position will be filled at the DR-03 level and is located at Wright-Patterson Air Force Base in Dayton, Ohio. Your application WILL NOT be considered if all required documents are not submitted. See the list of required documents at the bottom of the announcement.
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