Microchip Technology Inc.
Principal Engineer - Packaging
Microchip Technology Inc., San Jose, California, United States, 95199
Join to apply for the
Principal Engineer - Packaging
role at
Microchip Technology Inc. Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar global organization? We offer all that and more at Microchip Technology, Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Job Description
We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development. Responsibilities
Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages. Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices. Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology. Create package design documentation and assembly instructions. Participate in package technology development and/or other business productivity projects which have broad team impact. Manage package qualification for commercial and automotive applications. Coordinate with assembly vendors on new packages from development to high volume production. Requirements/Qualifications
Bachelor’s or Master’s Degree in Electrical or Mechanical Engineering. Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging. Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA, WLCSP, wire bond BGA, and CSP. Strong understanding of materials as related to chip packaging interaction. Familiar with wafer BEOL. Strong knowledge of advanced substrate manufacturing/process. Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification. Proven project management, communication, and leadership skills. Willingness and ability to grow expertise in multiple disciplines. Strong technical skills in resolving customer issues related to IC package quality and reliability. Travel up to 10% is expected. Preferred Qualifications
Experience with Ansys Electronic Desktop. Knowledgeable with failure analysis techniques on package technologies. Experience with Cadence APD and AutoCad for custom substrate design. Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
#J-18808-Ljbffr
Principal Engineer - Packaging
role at
Microchip Technology Inc. Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar global organization? We offer all that and more at Microchip Technology, Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Job Description
We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development. Responsibilities
Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages. Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices. Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology. Create package design documentation and assembly instructions. Participate in package technology development and/or other business productivity projects which have broad team impact. Manage package qualification for commercial and automotive applications. Coordinate with assembly vendors on new packages from development to high volume production. Requirements/Qualifications
Bachelor’s or Master’s Degree in Electrical or Mechanical Engineering. Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging. Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA, WLCSP, wire bond BGA, and CSP. Strong understanding of materials as related to chip packaging interaction. Familiar with wafer BEOL. Strong knowledge of advanced substrate manufacturing/process. Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification. Proven project management, communication, and leadership skills. Willingness and ability to grow expertise in multiple disciplines. Strong technical skills in resolving customer issues related to IC package quality and reliability. Travel up to 10% is expected. Preferred Qualifications
Experience with Ansys Electronic Desktop. Knowledgeable with failure analysis techniques on package technologies. Experience with Cadence APD and AutoCad for custom substrate design. Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
#J-18808-Ljbffr