Northrop Grumman
Staff Engineer RF Microwave Design - R10209685-2
Northrop Grumman, Baltimore, Maryland, United States
Overview
Staff Engineer RF Microwave Design - R10209685-2 at Northrop Grumman. Relocation assistance may be available. Clearance type: Polygraph. Travel: Yes, 10% of the time. Description: Northrop Grumman Microelectronics Center seeks a Staff Engineer RF Microwave Design to support cutting-edge superconducting electronics and energy-efficient computing technologies. The role involves collaborating with physicists, circuit design engineers, and superconducting foundry engineers to develop superconducting digital logic technology, Reciprocal Quantum Logic (RQL), and related RF/microwave designs. What You’ll Get To Do
Design, model, and verify RF, microwave, and mixed-signal subsystem assemblies Guide layout of Printed Wiring Boards (PWB) with component placement, interconnect routing, and drawing generation Interface with Electrical and Mechanical engineers to address mechanical fitment and electrical component placement for rigid, flex, and rigid-flex assemblies Interact with suppliers to enable fabrication of the finished product This position will serve 100% on-site in Linthicum, MD or Annapolis Junction, MD. Basic Qualifications
Bachelor degree in Electrical Engineering or comparable STEM degree and a minimum of 12 years of relevant engineering experience (10 years with MS degree; 8 years with PhD) Working knowledge of EMI/signal integrity control techniques and EM theory Working knowledge of EM simulation tools like HFSS or COMSOL Understanding of electrical and mechanical behavior of PCBs to influence layout decisions Prior experience working with electronics, mechanical requirements, and schematic drawings Must be willing to obtain and maintain an active Top Secret/SCI with Poly Security Clearance US Citizenship required Preferred Qualifications
Expert proficiency with RF/Microwave modeling, simulation, and PCB design tools (e.g. Keysight ADS, Xpedition, Altium) Experience with spectrum and network analyzer techniques for EMC measurements Packaging technologies experience (ceramic and laminate chip-level packages, PCBs, interposers, wire bonding, etc.) Experience with Cryogenic test stands, superconductivity and mechanical CTE PCB design for fabrication and PWB layer stack-up for digital, RF, mixed signal, and power supply CCAs Ability to provide solutions to a broad variety of RF/Microwave design and test problems of complex difficulty Familiarity with semiconductor processes and materials Salary and Benefits
Primary Level Salary Range: $163,200 - $244,800. The salary range represents a general guideline; base salary offers consider the scope and responsibilities of the position and the candidate's experience, education, skills, and current market conditions. Depending on the position, overtime, shift differential, and a discretionary bonus may be available in addition to base pay. Annual bonuses reward contributions and allow employees to share in company results. Vice President or Director positions may be eligible for Long Term Incentives. Northrop Grumman provides benefits including health insurance, life and disability insurance, savings plan, company-paid holidays and paid time off for vacation/personal business. The application period for the job posting is estimated to be 20 days from the posting date, but may be shortened or extended based on business needs and candidate availability. Equal Opportunity and Citizenship
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions. Additional job information
Seniority level: Mid-Senior level Employment type: Full-time Job function: Engineering and Information Technology Industries: Defense and Space Manufacturing
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Staff Engineer RF Microwave Design - R10209685-2 at Northrop Grumman. Relocation assistance may be available. Clearance type: Polygraph. Travel: Yes, 10% of the time. Description: Northrop Grumman Microelectronics Center seeks a Staff Engineer RF Microwave Design to support cutting-edge superconducting electronics and energy-efficient computing technologies. The role involves collaborating with physicists, circuit design engineers, and superconducting foundry engineers to develop superconducting digital logic technology, Reciprocal Quantum Logic (RQL), and related RF/microwave designs. What You’ll Get To Do
Design, model, and verify RF, microwave, and mixed-signal subsystem assemblies Guide layout of Printed Wiring Boards (PWB) with component placement, interconnect routing, and drawing generation Interface with Electrical and Mechanical engineers to address mechanical fitment and electrical component placement for rigid, flex, and rigid-flex assemblies Interact with suppliers to enable fabrication of the finished product This position will serve 100% on-site in Linthicum, MD or Annapolis Junction, MD. Basic Qualifications
Bachelor degree in Electrical Engineering or comparable STEM degree and a minimum of 12 years of relevant engineering experience (10 years with MS degree; 8 years with PhD) Working knowledge of EMI/signal integrity control techniques and EM theory Working knowledge of EM simulation tools like HFSS or COMSOL Understanding of electrical and mechanical behavior of PCBs to influence layout decisions Prior experience working with electronics, mechanical requirements, and schematic drawings Must be willing to obtain and maintain an active Top Secret/SCI with Poly Security Clearance US Citizenship required Preferred Qualifications
Expert proficiency with RF/Microwave modeling, simulation, and PCB design tools (e.g. Keysight ADS, Xpedition, Altium) Experience with spectrum and network analyzer techniques for EMC measurements Packaging technologies experience (ceramic and laminate chip-level packages, PCBs, interposers, wire bonding, etc.) Experience with Cryogenic test stands, superconductivity and mechanical CTE PCB design for fabrication and PWB layer stack-up for digital, RF, mixed signal, and power supply CCAs Ability to provide solutions to a broad variety of RF/Microwave design and test problems of complex difficulty Familiarity with semiconductor processes and materials Salary and Benefits
Primary Level Salary Range: $163,200 - $244,800. The salary range represents a general guideline; base salary offers consider the scope and responsibilities of the position and the candidate's experience, education, skills, and current market conditions. Depending on the position, overtime, shift differential, and a discretionary bonus may be available in addition to base pay. Annual bonuses reward contributions and allow employees to share in company results. Vice President or Director positions may be eligible for Long Term Incentives. Northrop Grumman provides benefits including health insurance, life and disability insurance, savings plan, company-paid holidays and paid time off for vacation/personal business. The application period for the job posting is estimated to be 20 days from the posting date, but may be shortened or extended based on business needs and candidate availability. Equal Opportunity and Citizenship
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions. Additional job information
Seniority level: Mid-Senior level Employment type: Full-time Job function: Engineering and Information Technology Industries: Defense and Space Manufacturing
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