Qualcomm
Sr Staff or Principal Thermal Engineer, Server Packaging
Qualcomm, San Diego, California, United States, 92189
Sr Staff or Principal Thermal Engineer, Server Packaging
Join to apply for the Sr Staff or Principal Thermal Engineer, Server Packaging role at Qualcomm Overview
Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Key Responsibilities
Lead thermal architecture solutions through simulation and test while working with various stakeholders. Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase. Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations. Develop custom SW solutions to automate thermal modeling and test. Conduct thermal tests to validate/characterize models and present results to stakeholders. Analyze and document simulation and test results. Education
Required: MS in Mechanical Engineering Preferred: PhD in Mechanical Engineering Requirements
10+ years of industry experience in electronics cooling related to server products. Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan. Industry exposure to 2.5/3D packaging is highly desirable. Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development. Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC. Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment. Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable. Excellent presentation, negotiation, and communication skills. Ability to clearly communicate complex technical content in written and verbal formats. Some experience with AI/ML concepts, algorithms, and methodologies is a plus. Pay Range and Benefits
$180,400.00 - $270,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is only one component of total compensation at Qualcomm. We offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. Our benefits package supports you at work, at home, and at play. Your recruiter can discuss details. More information about US benefits is available. EEO and Accommodation
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need accommodation during the application/hiring process, Qualcomm provides an accessible process. You may email disability-accomodations@qualcomm.com or call the toll-free number. Qualcomm will provide reasonable accommodations upon request. Qualcomm is committed to making our workplace accessible for individuals with disabilities. EEO Employer: All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other protected status. Notice
Qualcomm is not accepting unsolicited resumes or applications from staffing and recruiting agencies. This site is for Qualcomm applicants only.
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Join to apply for the Sr Staff or Principal Thermal Engineer, Server Packaging role at Qualcomm Overview
Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Key Responsibilities
Lead thermal architecture solutions through simulation and test while working with various stakeholders. Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase. Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations. Develop custom SW solutions to automate thermal modeling and test. Conduct thermal tests to validate/characterize models and present results to stakeholders. Analyze and document simulation and test results. Education
Required: MS in Mechanical Engineering Preferred: PhD in Mechanical Engineering Requirements
10+ years of industry experience in electronics cooling related to server products. Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan. Industry exposure to 2.5/3D packaging is highly desirable. Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis and tool development. Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak and Celsius EC. Capability to design, execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment. Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable. Excellent presentation, negotiation, and communication skills. Ability to clearly communicate complex technical content in written and verbal formats. Some experience with AI/ML concepts, algorithms, and methodologies is a plus. Pay Range and Benefits
$180,400.00 - $270,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is only one component of total compensation at Qualcomm. We offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. Our benefits package supports you at work, at home, and at play. Your recruiter can discuss details. More information about US benefits is available. EEO and Accommodation
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need accommodation during the application/hiring process, Qualcomm provides an accessible process. You may email disability-accomodations@qualcomm.com or call the toll-free number. Qualcomm will provide reasonable accommodations upon request. Qualcomm is committed to making our workplace accessible for individuals with disabilities. EEO Employer: All qualified applicants will receive consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other protected status. Notice
Qualcomm is not accepting unsolicited resumes or applications from staffing and recruiting agencies. This site is for Qualcomm applicants only.
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