Qualcomm
Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!
Our Mission: We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability.
Position: Signal Integrity Architect. We are seeking an experienced Signal Integrity Architect to develop high-performance signal integrity solutions tailored for advanced server applications.
Key Responsibilities
Collaborate with SoC, applications engineering, packaging, and system design teams to define and implement system interconnects that meet the unique demands of high-end server environments. Provide guidelines and feedback on silicon timing, bump/RDL, package pinout and PCB specifications. Develop customer guidelines and define module interfaces/formats for simulation. Lead the creation of server-grade SI models, simulations, and final designs. Perform early SI analysis on 2.5D/3D structures and establish design guidelines. Update and automate design and analysis flows. Prepare and present technical documentation and reports to stakeholders. Minimum Qualifications
Master’s degree in Electrical or Computer Engineering, with a specialization in Signal Integrity. 6+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems. Strong knowledge of SI fundamentals, including power distribution networks, EMIR, transmission line theory, crosstalk, S-parameters, and channel simulations. Expertise in DDR5/LPDDR5X JEDEC specifications and/or SerDes standards. Experience in developing SI methodologies from die to system, with lab correlation and validation. Proficiency with 2D/2.5D/3D EM simulation tools. Hands-on experience creating complex SI models and performing both frequency and time-domain simulations. Proficiency in Unix/Linux environments and experience with EDA tools through scripting. Strong knowledge of packaging and PCB technologies, design, and manufacturing processes. Familiarity with 2.5D/3D packaging technologies. Hands-on experience with electrical validation and compliance testing. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications
Ph.D. in Electrical or Computer Engineering, specializing in SI. 10+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems. In-depth understanding of computational electromagnetics and transmission line theory. Proficiency in DDR5 and LPDDR5X timing budgets, jitter analysis, and PHY design/link analysis. Experience with SI simulation for PCIe Gen6+, multi-gigabit serial buses. Experience with package and PCB design tools. Proficiency in scripting with MATLAB, Perl, and Python. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, please contact us.
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Collaborate with SoC, applications engineering, packaging, and system design teams to define and implement system interconnects that meet the unique demands of high-end server environments. Provide guidelines and feedback on silicon timing, bump/RDL, package pinout and PCB specifications. Develop customer guidelines and define module interfaces/formats for simulation. Lead the creation of server-grade SI models, simulations, and final designs. Perform early SI analysis on 2.5D/3D structures and establish design guidelines. Update and automate design and analysis flows. Prepare and present technical documentation and reports to stakeholders. Minimum Qualifications
Master’s degree in Electrical or Computer Engineering, with a specialization in Signal Integrity. 6+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems. Strong knowledge of SI fundamentals, including power distribution networks, EMIR, transmission line theory, crosstalk, S-parameters, and channel simulations. Expertise in DDR5/LPDDR5X JEDEC specifications and/or SerDes standards. Experience in developing SI methodologies from die to system, with lab correlation and validation. Proficiency with 2D/2.5D/3D EM simulation tools. Hands-on experience creating complex SI models and performing both frequency and time-domain simulations. Proficiency in Unix/Linux environments and experience with EDA tools through scripting. Strong knowledge of packaging and PCB technologies, design, and manufacturing processes. Familiarity with 2.5D/3D packaging technologies. Hands-on experience with electrical validation and compliance testing. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications
Ph.D. in Electrical or Computer Engineering, specializing in SI. 10+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems. In-depth understanding of computational electromagnetics and transmission line theory. Proficiency in DDR5 and LPDDR5X timing budgets, jitter analysis, and PHY design/link analysis. Experience with SI simulation for PCIe Gen6+, multi-gigabit serial buses. Experience with package and PCB design tools. Proficiency in scripting with MATLAB, Perl, and Python. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, please contact us.
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