Qualcomm
General Summary
In this highly visible role, you will be responsible for developing advanced 2.5D packaging technologies and defining baseline assembly processes that are optimized for performance, reliability, yield, and cost across multiple product application spaces for high performance computing. Extensive knowledge and experience in 2.5D package technology development including architecture definition, assembly processes, thermal-mechanical, materials, and chip-package-interactions are required. This position also requires the ability to lead cross-functional teams, manage multiple foundries and OSATs, and resolve complex technical issues. Principal Duties & Responsibilities
Provide leadership and be responsible for developing advanced 2.5D packaging technologies, new product introduction, and high-volume manufacturing. Leverage subject matter expertise in package architecture, high density interconnect, performance, reliability, and cost constraints. Apply hands-on experience in packaging assembly processes, materials, equipment, and design rules. Work with and manage multiple foundries and OSATs to bring up packaging solutions from concept to HVM. Lead cross-functional teams and manage multiple programs. Resolve complex technical issues. Minimum Qualifications
Bachelor's degree in Mechanical, Electrical or Materials Engineering or related field and 8+ years of experience in advanced packaging technology development, new product introduction and high volume manufacturing. Master's degree in Mechanical, Electrical or Materials Engineering or related field and 7+ years of advanced packaging technology development or related work experience. PhD in Mechanical, Electrical or Materials Engineering or related field and 6+ years of advanced packaging technology development or related work experience. Preferred Qualifications
M.S. or Ph.D. in Mechanical, Electrical or Materials Engineering or equivalent. 15+ years of hands-on experience in packaging technology development in 2.5D/3D for high density D2D interconnects, RDL, fanout bridges, FCBGA, MCM, and related work experience. Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products. Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques. Familiarity with substrate manufacturing processes and design rules. Excellent verbal and written communication skills. Demonstrated organized technical project management skills. Ability to work independently and lead multiple programs. Ability to lead multi-functional teams to solve complex technical problems. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Pay Range And Other Compensation & Benefits: $201,600.00 - $302,400.00. The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is only one component of total compensation at Qualcomm. We offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. Our benefits package supports success at work, at home, and at play. Your recruiter can discuss details about Qualcomm benefits.
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In this highly visible role, you will be responsible for developing advanced 2.5D packaging technologies and defining baseline assembly processes that are optimized for performance, reliability, yield, and cost across multiple product application spaces for high performance computing. Extensive knowledge and experience in 2.5D package technology development including architecture definition, assembly processes, thermal-mechanical, materials, and chip-package-interactions are required. This position also requires the ability to lead cross-functional teams, manage multiple foundries and OSATs, and resolve complex technical issues. Principal Duties & Responsibilities
Provide leadership and be responsible for developing advanced 2.5D packaging technologies, new product introduction, and high-volume manufacturing. Leverage subject matter expertise in package architecture, high density interconnect, performance, reliability, and cost constraints. Apply hands-on experience in packaging assembly processes, materials, equipment, and design rules. Work with and manage multiple foundries and OSATs to bring up packaging solutions from concept to HVM. Lead cross-functional teams and manage multiple programs. Resolve complex technical issues. Minimum Qualifications
Bachelor's degree in Mechanical, Electrical or Materials Engineering or related field and 8+ years of experience in advanced packaging technology development, new product introduction and high volume manufacturing. Master's degree in Mechanical, Electrical or Materials Engineering or related field and 7+ years of advanced packaging technology development or related work experience. PhD in Mechanical, Electrical or Materials Engineering or related field and 6+ years of advanced packaging technology development or related work experience. Preferred Qualifications
M.S. or Ph.D. in Mechanical, Electrical or Materials Engineering or equivalent. 15+ years of hands-on experience in packaging technology development in 2.5D/3D for high density D2D interconnects, RDL, fanout bridges, FCBGA, MCM, and related work experience. Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products. Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques. Familiarity with substrate manufacturing processes and design rules. Excellent verbal and written communication skills. Demonstrated organized technical project management skills. Ability to work independently and lead multiple programs. Ability to lead multi-functional teams to solve complex technical problems. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Pay Range And Other Compensation & Benefits: $201,600.00 - $302,400.00. The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Salary is only one component of total compensation at Qualcomm. We offer a competitive annual discretionary bonus program and opportunity for annual RSU grants. Our benefits package supports success at work, at home, and at play. Your recruiter can discuss details about Qualcomm benefits.
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